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Method for processing semiconductor regions

A semiconductor and regional technology, applied in semiconductor devices, semiconductor/solid-state device manufacturing, electrical components, etc., can solve problems such as reducing reliability and increasing the risk of chip failure

Active Publication Date: 2021-01-15
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The resulting non-uniformities 204 and voids 206 increase the risk of failure and reduce the reliability of the easily manufactured chip

Method used

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  • Method for processing semiconductor regions
  • Method for processing semiconductor regions
  • Method for processing semiconductor regions

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Experimental program
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Embodiment approach

[0100] According to various embodiments, for example by physical vapor deposition (PVD, such as sputtering), electrochemical deposition (such as electroplating), electroless chemical deposition (such as electroless plating) and chemical vapor deposition (CVD, such as plasma enhanced CVD) , a metallic material (eg, used to form at least one of metallization layer 804 and further metallization layer 814 ) may be disposed over semiconductor region 602 .

[0101] Figure 9A to Figure 9D The electronic device in the method according to various embodiments is shown in a schematic side view or a cross-sectional view, respectively.

[0102] In 900a , an electronic device may include a semiconductor region 602 . The semiconductor region 602 in 900a may be configured similarly to the semiconductor region 602 in 600a.

[0103] In 900 a , a deposit removal layer 604 may be formed over the semiconductor region 602 , for example over the surface 802 (also referred to as the first surface ...

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PUM

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Abstract

According to various embodiments, a method for treating a semiconductor region comprising at least one precipitate may include forming a precipitate removal layer over the semiconductor region, wherein the precipitate removal layer may define an absorption temperature for a composition of the at least one precipitate The chemical solubility in the precipitate removal layer is greater than the chemical solubility in the semiconductor region at the absorption temperature; and at least one precipitate is heated above the absorption temperature.

Description

technical field [0001] Various embodiments generally relate to methods and electronic devices for processing semiconductor regions. Background technique [0002] In general, semiconductor technology may process semiconductor material on or in a substrate (also called a wafer or carrier), for example to manufacture integrated circuits (also called chips). During the manufacture of integrated circuits, certain processes may be applied, such as doping the semiconductor material, planarizing the substrate, forming one or more layers over the substrate, structuring one or more layers, or making contact easy Manufactured chips. [0003] Traditionally, planarization utilizes chemical polishing processes and / or mechanical polishing processes. Due to quality criteria, it may be difficult to adapt the process setup to various technologies, various wafer diameters and various wafer (eg, silicon) thicknesses. In addition, the process parameter window may be very narrow, which increas...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/306
CPCH01L21/306H01L21/221H01L21/02068H01L21/02082H01L21/0209H01L21/2251H01L21/30604H01L21/3247H01L29/167
Inventor 桑德拉·维尔蒂奇马里奥·巴鲁希奇罗伯特·哈特尔亚历山大·欣茨伊夫林·纳佩特施尼格乔治·希恩纳
Owner INFINEON TECH AG