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Reaction products of diamines with reaction products of monoamines and bisanhydrides as additives for electroplating baths

一种反应产物、二胺的技术，应用在电气元件、无线电传输系统、基于链路质量的传输修改等方向

Active Publication Date: 2017-12-08
ROHM & HAAS ELECTRONICS MATERIALS LLC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This is especially challenging when the PCB contains vias and blind vias

Method used

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  • Reaction products of diamines with reaction products of monoamines and bisanhydrides as additives for electroplating baths
  • Reaction products of diamines with reaction products of monoamines and bisanhydrides as additives for electroplating baths
  • Reaction products of diamines with reaction products of monoamines and bisanhydrides as additives for electroplating baths

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0102] In Step 1, ethylenediaminetetraacetic acid (EDTA) bisanhydride (10 mmol) was dissolved in 30 mL of dimethylformamide (DMF), and 20 mmol of 1H-imidazole-1-propanamine (structure A) was dissolved in 30 mL of DMF. The EDTA bisanhydride solution was added dropwise to the 1H-imidazole-1-propanamine solution for 12 hours at room temperature. The reaction product was precipitated by adding 60 mL of absolute ethanol, then washed with acetone and dried under vacuum. The reaction product includes the inner salt as shown by structure (B).

[0103] In Step 2, 10 mmol of the reaction product of Step 1 and 10 mmol of hexamethylenediamine (C) were mixed at room temperature. The mixture was then heated at 145° C. for 6 hours under a nitrogen atmosphere. The final product (D) was used without further purification.

[0104]

[0105] Three aqueous acid copper electroplating baths were prepared with the basic formulations disclosed in Table 1 below.

[0106] Table 1

[0107]

...

example 3

[0116] In Step 1, EDTA bisanhydride (10 mmol) was dissolved in 30 mL of dimethylformamide (DMF), and 20 mmol of benzimidazole-2-propanamine compound of structure A' was dissolved in 30 mL of DMF. The EDTA bisanhydride solution was added dropwise to the benzimidazole-2-propanamine solution for 12 hours at room temperature. The reaction product was precipitated by adding 60 mL of absolute ethanol, then washed with acetone and dried under vacuum. The reaction product includes an inner salt as shown by structure (B').

[0117] In Step 2, 10 mmol of the reaction product of Step 1 and 10 mmol of hexamethylenediamine (C) were mixed at room temperature. The mixture was then heated at 145° C. for 6 hours under a nitrogen atmosphere. The final product (D') was used without further purification.

[0118]

[0119]

[0120] The desired reaction product, compound D' described above, provides a copper electroplating bath with good throwing power.

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Abstract

Reaction products of diamines with the reaction products of monoamines and bisanhydrides are included as additives in metal electroplating baths. The metal electroplating baths have good throwing power and deposit metal layers having substantially planar surfaces. The metal plating baths may be used to deposit metal on substrates with surface features such as through-holes and vias.

Description

technical field [0001] This invention relates to the reaction products of diamines and the reaction products of monoamines and bisanhydrides as electroplating bath additives. More particularly, the present invention relates to reaction products of diamines with reaction products of monoamines and bisanhydrides as electroplating bath additives to provide electroplating baths with good throwing power. Background technique [0002] Methods of electroplating an article with a metal coating generally involve passing an electrical current between two electrodes in a plating solution, one of which is the article to be plated. A typical acidic copper plating solution includes dissolved copper (usually copper sulfate), an acid electrolyte (such as sulfuric acid) in an amount sufficient to impart conductivity to the bath, a halide source, and specialized additives to improve plating uniformity and metal deposition quality. Such additives include, inter alia, levelers, accelerators an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G12/06C08L61/32
CPCC09D179/02C09D179/08C08G73/028C08G73/1017C25D3/38C25D3/32C25D3/58C25D3/60C07D241/04C07D265/33C07D413/06C07D413/10C07D413/12H04B7/0408H04B7/0619H04B7/0695H04W36/0079C25D3/30H04B7/0697H04J4/00H04J13/00H04L1/0003H04W36/0055H04W72/0446H04W72/0453H04W72/046H04W72/23
Inventor 段铃丽陈晨S·冯Z·I·尼亚齐姆贝托瓦M·A·瑞兹尼克
Owner ROHM & HAAS ELECTRONICS MATERIALS LLC
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