Full-automatic chamfering device applied to sieve plate

Abstract

The invention relates to the technical field of processing devices for sieve plates, in particular to a fully automatic chamfering device applied to sieve plates, including a workbench for placing sieve plates, a cutter head unit, a gantry processing unit, a cutter head control system and hole position positioning system, the workbench is installed under the beam of the gantry processing unit, and the cutter head unit is connected to the beam of the gantry processing unit; the hole position positioning system includes an industrial camera system and an industrial computer processing system, in which the camera system is set on the base of the chamfering cutter head, and the industrial control system The machine processing system extracts the image coordinates, accurately locates according to the extracted image coordinates, and transfers the precise position to the cutter head control system, and accurately chamfers the sieve plate through the cutter head control system. The invention adopts industrial camera positioning combined with software to guide the cutter head to perform chamfering processing, and can perform positioning and guiding chamfering of randomly arranged sieve plate holes, greatly improving processing efficiency and processing accuracy, and reducing processing costs.

Description

technical field [0001] The invention relates to the technical field of processing devices for sieve plates, in particular to a fully automatic chamfering device applied to sieve plates. Background technique [0002] Sieve plate is one of the most commonly used equipment in chemical industry. The annual demand is huge, and the chemical industry is a dangerous industry. The precision and strength of the equipment must meet the industry's design standards and safety parameters. [0003] Each square meter of a sieve plate is different according to the design requirements, and generally there are 10,000 to 30,000 sieve plate holes. At present, sieve plate holes are generally chamfered manually or machine-polished in sieve plate processing. However, manual chamfering has poor precision, long working hours and high cost. Machine grinding will reduce the plate thickness in some areas, affect the strength, and cause safety hazards. More importantly, the large number of sieve plate...

AI Technical Summary

Problems solved by technology

However, the accuracy of manual chamfering is poor, the working hours are long, and the cost is high

Machine grinding will reduce the plate thickness in some areas, affect the strength, and cause safety hazards. More importantly, the large number of sieve plate holes and small sieve plate hole area on a sieve plate make the positioning of the holes accurate when the machine is polished. Sexuality has caused great difficulties, so that there are certain safety hazards in the use of sieve plates

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