Low-temperature co-fired microwave dielectric ceramic material and preparation method thereof

Abstract

The invention provides a microwave dielectric ceramic material which can be cofired with a silver or copper electrode at a low temperature and a preparation method thereof. The microwave dielectric ceramic material is prepared from a microwave dielectric ceramic material 1-y-z[(1-x)Mg2SiO4-xCa2SiO4]-yCaTiO3-zCaZrO3, and mixed with a multicomponent glass material Li2O-BaO-SrO-CaO-B2O3-SiO2, wherein x is more than or equal to 0.2 and is less than or equal to 0.7, y is more than or equal to 0.05 and is less than or equal to 0.3, and z is more than or equal to 0.02 and is less than or equal to 0.15. The low-temperature co-fired microwave dielectric ceramic material can be co-fired with silver or copper and other conductive metals at 900-970 DEG C at an atmosphere and inert gas environment. The material has excellent characteristics of low dielectric consumption, high quality factor, low temperature capacitance and the like, and is applicable to multilayer ceramic component manufacture procedure and processing after being fired.

Description

technical field [0001] The invention relates to a microwave dielectric material and its preparation method, in particular to the microwave dielectric material produced by low temperature co-fired ceramic technology. Background technique [0002] With the needs and development of the current communication industry, in order to meet the multi-functional and thin, light and small requirements of wireless communication modules, the miniaturization and modularization of radio frequency circuits has become the focus of research and development in today's industry. The size of microwave components and the spacing between wires are constantly shrinking, so that when electronic signals are transmitted between metals, the resistance-capacitance value between metal wires increases, which increases power consumption and exchange interference between signals and causes signal delays ( RC slow). In addition, low temperature co-fired ceramic materials and process technology have been wide...

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Problems solved by technology

However, although the above method can reduce the sintering temperature of the original ceramic material, because the properties of the added material and the raw material are different, it usually affects the properties of the original material (such as high-frequency dielectric properties), or makes subsequent processing difficult.

[0007] In addition, in addition to lowering the sintering temperature of glassy materials, microwave dielectric materials and glass materials must be made into slurry in the high-frequency multilayer capacitor assembly process. Polyvinyl alcohol (PVA) or polyvinyl alcohol (PVA) or polyvinyl alcohol (PVA) Vinyl butyral (PVB) as a binder, according to previous research reports [J.Am.Ceram.Soc., 93 3049-3051 (2010)], PVA or PVB and flux boron oxide (B 2 o 3 ) will produce a crosslinking reaction to form a three-dimensional (three dimentional; 3-D) network gel state structure, which will greatly increase the viscosity of the slurry, which is not conducive to the coating process and cannot be applied to the production of multilayer capacitor components.

[0008] However, how to take into account low-temperature sintering and maintain the superior electrical properties and machinability of ceramic materials has always been a difficult problem in material design.

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