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Magnesium alloy plate and copper alloy plate welding method

A magnesium alloy and copper alloy technology, applied in welding equipment, electron beam welding equipment, welding/welding/cutting items, etc., can solve the problems of linear expansion coefficient, large difference in melting point, difficult welding, etc., to improve joint strength, The effect of suppressing generation

Inactive Publication Date: 2018-01-30
CHANGSHU INSTITUTE OF TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, the copper element in the H70 copper alloy and the magnesium element in the AZ31 magnesium alloy will directly generate a large amount of Mg during the welding process. 2 Cu intermetallic compound, hard and brittle, at the same time, due to the large difference in the linear expansion coefficient and melting point of the two alloys, it is not easy to weld

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  • Magnesium alloy plate and copper alloy plate welding method
  • Magnesium alloy plate and copper alloy plate welding method
  • Magnesium alloy plate and copper alloy plate welding method

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Embodiment 1

[0022] In this embodiment, the AZ31 magnesium alloy plate and the H70 copper alloy plate with dimensions of 100*50*3 mm are welded.

[0023] This embodiment includes the following steps:

[0024] S 1 , machining H70 copper alloy and AZ31 magnesium alloy to obtain plates to be welded;

[0025] S 2 , use 400 mesh sandpaper to grind and polish the H70 copper alloy plate and AZ31 magnesium alloy plate, and then put them into the acetone solution for ultrasonic cleaning for 10 to 15 minutes to remove surface oil and other sundries to ensure that the surface is clean;

[0026] S 3 , put the AZ31 magnesium alloy sheet into the electroplating equipment, and perform copper plating in 5L electroplating solution. The thickness of the copper plating layer is controlled within the range of 50-100μm, and the thickness is uniform;

[0027] S 4 , the copper plated layer on the AZ31 magnesium alloy sheet is bonded to the H70 copper alloy sheet and pressurized to obtain an assembly;

[00...

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Abstract

The invention provides a magnesium alloy plate and copper alloy plate welding method, and belongs to the technical field of special metal welding. The magnesium alloy plate and copper alloy plate welding method comprises the following steps: carrying out copper plating treatment a connecting surface, which is in contact with a copper alloy plate, on a magnesium alloy plate by a single surface electroplating process; after copper plating is finished, attaching a copper plated layer on the magnesium alloy plate to the copper alloy plate and pressing to obtain an assembly part; and carrying out electron beam welding on the assembly part to finish welding of the magnesium alloy plate and the copper alloy plate. Copper is plated on the surface of the magnesium alloy plate at first, then the copper alloy plate and the copper plated magnesium alloy plate are welded by electron beam welding to realize metallurgical interconnection, generation of a Mg2Cu intermetallic compound can be suppressedeffectively, and the strength of a joint is improved.

Description

technical field [0001] The invention relates to a technology in the field of dissimilar metal welding, in particular to a method for welding a magnesium alloy plate and a copper alloy plate. Background technique [0002] H70 copper alloy is a copper alloy material based on copper element and supplemented by metal elements such as zinc. It has good electrical conductivity and thermal conductivity, and is widely used in industrial fields such as electricians and radiators; The most widely used magnesium alloy material, light weight, high specific strength, good heat dissipation, good shock absorption. The combination of two metals can be used to make a lightweight radiator with good shock resistance. [0003] However, the copper element in the H70 copper alloy and the magnesium element in the AZ31 magnesium alloy will directly generate a large amount of Mg during the welding process. 2 Cu intermetallic compound is hard and brittle. At the same time, due to the large differen...

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Application Information

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IPC IPC(8): B23K15/00B23K103/18
Inventor 戴军杨莉张尧成刘坡周仕远姜伟陈春霖
Owner CHANGSHU INSTITUTE OF TECHNOLOGY