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Paper-based upper cover tape and preparation method thereof

A cover tape and paper-based technology, applied in chemical instruments and methods, lamination, packaging, etc., can solve the problems of tediousness, polyester film that cannot be recycled and reused, and physical injury of operators

Inactive Publication Date: 2018-02-09
浙江洁美电子信息材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above-mentioned process is not only cumbersome and increases the cost, but also the applied electrostatic agent and adhesive need to be diluted with a solvent, and the volatilization of the solvent and adhesive will cause harm to the operator's body; the polyester film after use cannot be recycled and reused, which is not conducive to environmental protection

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A paper-based top cover tape is composed of a thin paper substrate layer and an ethylene-vinyl acetate copolymer layer attached to the thin paper substrate layer. The thickness of the copolymer layer is 10-18μm; the surface resistivity is less than or equal to 1*E10. In this embodiment, the thickness of the copolymer layer is 12 μm.

[0027] The copolymer layer contains 0.3%-3.0% by mass of non-ionic antistatic agent, and the non-ionic antistatic agent is ethoxylated stearyl phthalamide or ethoxylated lauryl phthalamide. In this embodiment, the copolymer layer contains 0.5% by mass of ethoxylated stearylamide.

[0028] The ethylene-vinyl acetate copolymer layer is prepared by melting and extruding the non-ionic antistatic agent into the ethylene-vinyl acetate copolymer raw material after drying under hot air at 70°C to 80°C for 4 hours. In this embodiment, the temperature of the hot air is 75°C.

[0029] In this example, the optional thin paper substrate layer: thick...

Embodiment 2

[0032] A paper-based top cover tape, comprising a thin paper substrate layer, a low-density polyethylene layer attached to the thin paper substrate layer, and an ethylene-vinyl acetate copolymer layer attached to the low-density polyethylene layer constitute. The thickness of the low-density polyethylene layer is 10-12 μm, and the thickness of the copolymer layer is 10-18 μm; the surface resistivity is less than or equal to 1*E10. In this embodiment, the thickness of the low-density polyethylene layer is 10 μm, and the thickness of the copolymer layer is 12 μm.

[0033] The copolymer layer contains 0.3%-3.0% by mass of non-ionic antistatic agent, and the non-ionic antistatic agent is ethoxylated stearyl phthalamide or ethoxylated lauryl phthalamide. In this embodiment, the copolymer layer contains 2.0% by mass of ethoxylated laurylamide.

[0034] The ethylene-vinyl acetate copolymer layer is prepared by melting and extruding the non-ionic antistatic agent into the ethylene-v...

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Abstract

The invention relates to the technical field of electronic component packaging, in particular to a upper cover tape matched with a paper carrier tape for use. The paper-based upper cover tape comprises a thin paper base material layer and an ethylene-vinyl acetate copolymer layer attached to the thin paper base material layer; the ethylene-vinyl acetate copolymer layer contains a non-ionic antistatic agent with mass of 0.3% to 3.0%; a thickness of the copolymer layer is 10 to 18 mu m; surface resistivity is smaller than or equal to 1*E10. Thin paper is used as a base material, the thin paper contains certain moisture, the surface resistivity is smaller than or equal to 1*E10, and the thin paper per se does not have static electricity, is difficult to adhere and does not need to be coated with an antistatic agent; the thin paper can be directly compounded with a low-density polyethylene layer or the ethylene-vinyl acetate copolymer layer after being subjected to corona processing, and does not need to utilize an adhesive; the thin paper has certain stiffness with respect to a polyester film, and a finished product is easy to part off and wind.

Description

technical field [0001] The invention relates to the technical field of packaging of electronic components, in particular to an upper cover tape used in conjunction with a paper carrier tape. Background technique [0002] The packaging, transportation and access of electronic components must have corresponding carriers. At present, the carrier packaging of chip electronic components uses paper carrier tape. After the chip electronic components are placed in the storage hole of the carrier tape, it needs Use the cover tape to seal the storage hole. When using, you need to peel off the cover tape and access the electronic components in the storage hole. The performance of the cover tape directly affects the quality of chip electronic component packaging, the efficiency during use and the quality of component installation. The top cover tapes on the market now use polyester film as the base material, and the finished product generally includes multiple layers such as antistatic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/30B32B27/10B32B27/18B32B27/32B32B38/00B65D73/02
CPCB32B27/306B32B27/10B32B27/18B32B27/32B32B38/0008B32B2307/21B65D73/02
Inventor 姜兆宏
Owner 浙江洁美电子信息材料有限公司
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