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Copper-silver composite material preparation method

A composite material, copper-silver technology, applied in the field of preparation of copper-silver composite materials, can solve the problems such as the decrease of electrical conductivity, achieve the effects of reducing solid solubility, increasing effective strengthening, and reducing solid solution scattering

Inactive Publication Date: 2018-03-06
陈广新
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, during the processing of such materials, the electrical conductivity usually decreases significantly with the increase of strength. How to enhance the strength of materials while maintaining high electrical conductivity is the key to the research of this type of materials.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Using oxygen-free copper and electrolytic silver as raw materials, Cu-Ag alloy liquid is made after smelting, and its composition is Ag 10% by weight percentage, and the balance is Cu;

[0017] Place the Cu-Ag alloy liquid in a vacuum electric furnace, heat it to 960°C, hold it for 1 hour, and then cool it with the furnace to obtain the cast Cu-Ag alloy; during the process of heat preservation and cooling with the furnace, apply a strength of 10T to the vacuum electric furnace The steady magnetic field;

[0018] Keep the cast Cu-Ag alloy at 700°C for 3 hours, then hot forge at 650°C to make a deformed Cu-Ag alloy, and control the area reduction rate of the deformed Cu-Ag alloy to 5%;

[0019] Draw the deformed Cu-Ag alloy at room temperature, keep the drawing direction perpendicular to the hot forging direction, and make a deformed Cu-Ag composite material, and control the total area reduction rate of the deformed Cu-Ag composite material to 70%;

[0020] The deformed ...

Embodiment 2

[0022] Method is with embodiment 1, and difference is:

[0023] Cu-Ag alloy liquid composition contains Ag 15% by weight percentage;

[0024] Heating to 1100°C and holding for 0.8 hours; applying a steady magnetic field with a strength of 11T to the vacuum electric furnace;

[0025] The as-cast Cu-Ag alloy was kept at 750°C for 2 hours, and then hot forged at 700°C, with an area reduction rate of 8%;

[0026] The total area reduction rate of the controlled deformation Cu-Ag composite material is 75%;

[0027] The heat treatment temperature is 450° C., and the heat treatment time is 2 hours.

Embodiment 3

[0029] Method is with embodiment 1, and difference is:

[0030] Cu-Ag alloy liquid composition contains Ag 20% ​​by weight percentage;

[0031] Heating to 1200°C and holding for 0.5 hours; applying a steady magnetic field with a strength of 12T to the vacuum electric furnace;

[0032] The as-cast Cu-Ag alloy was kept at 800°C for 1 hour, then hot forged at 750°C, and the area reduction rate was 10%;

[0033] The total area reduction rate of the controlled deformation Cu-Ag composite material is 80%;

[0034] The heat treatment temperature was 500° C., and the heat treatment time was 1 hour.

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Abstract

A preparation method for preparing a copper-silver composite material, which is carried out according to the following steps: (1) use oxygen-free copper and electrolytic silver as raw materials, and make Cu-Ag alloy liquid after melting; (2) place it in a vacuum electric furnace, heat and keep Cool with the furnace and apply a constant magnetic field; (3) keep warm at 700-800°C for 1-3 hours, and then hot forge; (4) draw at room temperature; (5) conduct vacuum heat treatment to obtain copper-silver composite Material. The method of the present invention can achieve the purpose of refining Cu dendrites, can reduce the solid solution of Ag atoms in the Cu matrix, reduce the solid solubility of Ag in the matrix, increase the effective strengthening, and reduce the solid solution scattering of conductive electrons.

Description

technical field [0001] The invention belongs to the field of material preparation, in particular to a method for preparing a copper-silver composite material. Background technique [0002] High-strength and high-conductivity Cu-based composite materials are mainly used in the fields of high-speed train contact wires, integrated circuit lead frame materials, high-pulse magnet coils, and electrical contact materials. They are structural and functional materials with a good combination of strength and conductivity. However, during the processing of such materials, the electrical conductivity usually decreases significantly with the increase of strength. How to enhance the strength of materials while maintaining high electrical conductivity is the key to the research of this type of materials. Existing studies mainly choose to add transition group elements with low solid solubility, such as bcc metals such as Nb, Cr, and Fe, and fcc metal elements such as Ag, to the Cu matrix. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C1/02C22C9/00C22F1/08C21D1/04
CPCC22C1/02C21D1/04C22C9/00C22F1/08
Inventor 陈广新
Owner 陈广新
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