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Laser encapsulation method

A technology of laser encapsulation and laser beam, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., to achieve the effects of good encapsulation quality, good temperature rise, and excellent encapsulation quality

Active Publication Date: 2020-12-04
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a laser encapsulation method to solve the problem that the glass frit forms dense holes inside and near the edge

Method used

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  • Laser encapsulation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] The invention provides a laser packaging method, which adopts such as Figure 1a The laser scanning device shown, the laser scanning device includes: a controller module 110, a laser scanning module 111, a laser module 112 and a temperature monitoring module 113, wherein the controller module 100 is connected to the laser scanning module 111, the laser Module 112 and temperature monitoring module 113 are connected, and are used for controlling laser module 112 and described laser scanning module 111 and scanning temperature, and described laser module 112 is connected with laser scanning module 111, and described laser module 111 is used for generating laser, with predetermined The power sends the laser light to the laser scanning module 111, the laser scanning module 111 is used to change the laser transmission direction and movement characteristics, and the temperature monitoring module 113 is used to monitor the scanning temperature of the laser light. Further, the la...

Embodiment 2

[0074] The difference between this embodiment and Embodiment 1 is that this embodiment uses a vibrating mirror as a laser scanning device. Due to the size constraint of the field of view of the galvanometer, it is necessary to determine the scanning field of view of the galvanometer during laser scanning. In its actual application, the steps are as follows:

[0075] Divide the glass frit 122 pattern with encapsulation into several sub-sections 132 of equal length, take the sub-section 132 as 29 mm in length, and obtain N sub-sections 132, and the length of the splicing area 131 is 1 mm;

[0076] Move the galvanometer to the top of the subsection 132 (1), so that the scanning field of view of the galvanometer covers as much as possible the connected subsection 132;

[0077] Select the subsection 132(1) to start packaging, and scan the laser beam output power of 115-130W at a constant speed of 4m / s from the start point 133(1) to the end point 134(1), the power curve is as follo...

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Abstract

The invention discloses a laser encapsulation method, which uses a laser to heat a glass frit pattern located between two substrates. The method includes: step 1: performing path division on the glass frit pattern, and dividing the glass frit pattern into several sub-section, and there is an overlapping area between two adjacent sub-sections, the overlapping area is called the splicing area; Step 2: Use the laser beam to repeatedly scan one sub-section in the several sub-sections, to be After the scanning is completed, move to the starting point of the next sub-section; Step 3: Repeat Step 2 until all frit patterns are scanned. The present invention not only provides quasi-synchronous uniform heating locally, but also enables the glass frit to reach a molten state in a short period of time by repeatedly scanning the sub-sections, and produces a scanning effect similar to a circle on a macroscopic scale. , so that the entire glass frit is softened and encapsulated successively, and a glass wall with controllable bonding ratio and better encapsulation quality is obtained.

Description

technical field [0001] The invention relates to the field of laser packaging, in particular to a laser packaging method. Background technique [0002] Optoelectronic semiconductor devices have been widely used in various fields of life. Among them, OLED (Organic Light Emitting Diode) has become a research hotspot due to its good color ratio, wide viewing angle, and high response speed, and has a good application prospect. However, the electrodes and organic layers in OLED displays are very sensitive to oxygen and moisture. Oxygen and moisture permeating into the OLED device from the external environment will seriously shorten the life of the OLED device. Therefore, it is very important to provide an effective hermetic seal for OLED devices. [0003] In recent years, a sealing method using frit-assisted laser heating has been applied to the sealing of OLED displays. The glass frit is doped with a material having a high absorption rate for a specific light wavelength and h...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L51/52H01L51/56
CPCH01L21/67115H01L21/67126H10K50/8426H10K71/00
Inventor 黄元昊
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD