Method and system for laser drilling

A laser drilling and laser technology, which is used in laser welding equipment, metal processing equipment, welding equipment, etc., can solve the problems of poor hole wall finish, poor roundness, affecting hole accuracy, etc., and achieves convenient and simple installation. A wide range, the effect of increasing the depth of processing

Pending Publication Date: 2018-03-23
HUAZHONG UNIV OF SCI & TECH
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Problems solved by technology

[0005] The purpose of the present invention is to provide a compound laser drilling method and system, aiming to solve the problem that the depth or taper of the aperture processed by the existing laser drilling processing device cannot be improved, the smoothness of the hole wall is poor, and the hole The roundness is not good, especially the recasting layer on the hole wall, which may even lead to hole blockage and other technical problems that affect the accuracy of the hole

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  • Method and system for laser drilling
  • Method and system for laser drilling
  • Method and system for laser drilling

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Embodiment Construction

[0034] In order to make the objectives, technical solutions and advantages of the present invention clearer, the following further describes the present invention in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0035] The present invention proposes a laser drilling method and system, which aims to solve the problem that the existing laser drilling device has poor hole wall finish, poor roundness of the hole, recast layer on the hole wall, and limited depth-to-diameter ratio And other technical issues.

[0036] It is understandable that, since the laser drilling method and system provided by the present invention...

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Abstract

The invention discloses a method and a system for laser drilling. The system for laser drilling comprises a laser light source, a beam splitting switch and a beam combining switch; a polarized beam conversion unit; the laser light source is used for emitting a fundamental-mode Gaussian beam; the beam splitting switch is used for controlling whether the fundamental-mode Gaussian beam to be deflected or not, when no deflection occurs, and the fundamental-mode Gaussian beam acts on a workpiece to be machined through the beam splitting switch; the polarized beam conversion unit is used for converting the deflected fundamental-mode Gaussian beam into an annular azimuthally polarization type Laguerre-Gaussian beam when the fundamental-mode Gaussian beam is deflected; and the beam combining switch is used for controlling the annular azimuthally polarization type Laguerre-Gaussian beam to be deflected so as to enable the deflected annular azimuthally polarization type Laguerre-Gaussian beam tobe coaxial with the fundamental-mode Gaussian beam emitted by the laser light source so that the annular azimuthally polarization type Laguerre-Gaussian beam can act on the workpiece to be machined.According to the method and the system, an aperture with a larger depth-to-width ratio and a smaller taper can be obtained under the condition of the same energy output.

Description

Technical field [0001] The invention belongs to the technical field of laser processing, and more specifically, relates to a laser drilling method and system. Background technique [0002] With the rapid development of science and technology, traditional processing methods can no longer meet the requirements of increasingly complex aperture processing. For example, processing micro-pores with a diameter of micrometers on a high melting point metal molybdenum plate; processing small holes with a diameter of tens of microns on a hard tungsten carbide alloy; processing a few hundred microns in diameter on a hard and brittle red and sapphire For hard and brittle materials such as deep holes, conventional machining methods are impossible. [0003] The laser beam is a beam of photons that are highly concentrated in space and time. The application of optical focusing technology can converge it in a very small range on the order of micrometers to obtain 10 5 W / cm 2 ~10 15 W / cm 2 Very high...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/046B23K26/06B23K26/064B23K26/382
CPCB23K26/046B23K26/064B23K26/0665B23K26/382
Inventor 覃贝伦秦应雄马修泉肖瑜彭浩唐霞辉
Owner HUAZHONG UNIV OF SCI & TECH
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