Wire saw device and workpiece cutting method
A cutting method and workpiece technology, applied in the direction of working accessories, fine working devices, manufacturing tools, etc., can solve the problems such as the influence of the shape and quality of finished wafers, and achieve the effect of improving surface quality and efficient capture
Active Publication Date: 2018-04-17
SUMCO CORP
View PDF6 Cites 2 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment
[0072] Hereinafter, examples of the present invention will be described, but not limited thereto.
[0073] (Invention example)
[0074] Use based on image 3 The shown wire saw device 1 of the present invention cuts a silicon single crystal ingot (300 mm in diameter and 300 mm in block length) as a workpiece W into wafers with a thickness of 0.8 to 0.9 mm. Here, the slurry collecting part 24 in the wire saw device 1 is composed of a receiving pan 24a and a supporting member 24b including metal plates or resin plates. Tilted 32° from the horizontal. Also, the minimum gap between the receiving tray 24a and the workpiece W was set at 22 mm.
[0075] And the movable control part 25 which consists of SUS was attached to the position where the distance of the slurry supply part 13 from the wire 12 in the vertical direction was 5 mm. Other cutting conditions are shown in Table 1 below.
[0076]
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| diameter | aaaaa | aaaaa |
Login to View More
Abstract
Provided are a wire saw device and a workpiece cutting method which are capable of efficiently collecting spattered slurry even in an intermediate stage of a workpiece cutting process and improving the surface quality of a cut workpiece. This wire saw device comprises: at least one wire (11) that is provided in a tensioned state so as to be capable of travelling in a direction crossing a workpieceW to be cut; a workpiece holding part (12) that holds the workpiece W and moves the workpiece W relative to the wire (11); a slurry supply part (13) that supplies slurry for cutting the workpiece W to the wire (11) from the upstream side in the traveling direction of the wire (11); and a slurry collecting part (14) for collecting slurry that spatters due to contact with the workpiece W. The wiresaw device is characterized in that the slurry collecting part (14) can be moved along the workpiece W in a state of being disposed adjacent to the workpiece W, and can be retracted from the workpieceW so as to be prevented from coming into contact with the wire (11).
Description
technical field [0001] The present invention relates to a wire saw device and a workpiece cutting method, in particular to a wire saw device capable of efficiently trapping splashed slurry even in the middle stage of the workpiece cutting process and improving the surface quality of the cut workpiece and the cutting method of the workpiece. Background technique [0002] Wafers used as substrates for semiconductor devices are manufactured by thinning an ingot containing silicon or compound semiconductors, etc., going through a plane grinding (grinding) process, an etching process, and a mirror grinding (polishing) process, and finally cleaning. In addition, in this specification, the object cut|disconnected by the wire saw apparatus is called "work" including these ingots. [0003] In general, a wire saw device for thinning a workpiece into a wafer shape includes: at least one wire stretched so as to travel in a direction transverse to the workpiece to be cut; holding the wo...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): B24B27/06B28D5/04B28D7/02H01L21/304
CPCB28D5/007Y02P70/10B24B27/06B28D5/04B28D7/02H01L21/304B28D5/0076B28D5/0082B28D5/045
Inventor 福田正树沟上和贵太田慎二
Owner SUMCO CORP