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Power module packaging structure

A packaging structure and power module technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of manual winding, high production costs, and large differences, and achieve simple process structure, good compatibility, and individual stray parameters. small difference effect

Pending Publication Date: 2018-04-20
MACMIC SCIENCE & TECHNOLOGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the current power module design, the main problems are insufficient product compatibility, unreasonable thermal design, high production cost, and insufficient consistency of electrical characteristics.
The traditional process is to use metal wire, the material is relatively soft, and it needs to be manually wound or fixed during the packaging process, and the difference between individuals is relatively large

Method used

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Embodiment

[0020] Reference figure 1 The present invention takes an IGBT module as an example, including a substrate 1, on which two direct copper substrates (DBC) 2 are brazed, and the two direct copper substrates (DBC) 2 are brazed with IGBT chips 7 and The diode chip 6, the power terminal 3 and the control power terminal 5 are soldered or ultrasonically welded to the direct copper substrate (DBC) 2. The substrate 1 also includes a support frame 4 and a chip resistor 8. The support frame 4 passes The card slot is connected to the control power terminal 5, and the chip resistor 8 is arranged on the control pole of the direct copper-clad substrate (DBC) 2.

[0021] Reference figure 2 , The two direct copper-clad substrates (DBC) are both provided with a collector, an emitter and a control electrode, the control electrode and the emitter on each of the direct-coated copper substrates are arranged on both sides of the collector, and The two control electrodes and the emitter are respectively...

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Abstract

The invention belongs to the technical field of transistor structures, and specifically relates to a power module packaging structure. The structure comprises a substrate, and the substrate is provided with two direct copper-coated base plates in a manner of braze welding, and the two direct copper-coated base plates are provide with an IGBT chip and a diode chip in a manner of braze welding. A power terminal and a control power terminal are welded to the direct copper-coated base plates through braze welding or supersonic welding, and the two direct copper-coated base plates are respectivelyprovided with a collector electrode, an emitter electrode and a control electrode. The collector electrode of one direct copper-coated base plate is connected with the emitter electrode of the other direct copper-coated base plate through an aluminium wire or a copper wire. The control electrode of one direct copper-coated base plate is connected with the other direct copper-coated base plate. Thestructure is simple, is good in compatibility, and is small in difference of individual stray parameters in batch production.

Description

Technical field [0001] The invention belongs to the technical field of transistor structures, and specifically relates to a power module packaging structure. Background technique [0002] IGBT (Insulated Gate Bipolar Transistor), insulated gate bipolar transistor, is a composite fully controlled voltage-driven power semiconductor device composed of BJT (bipolar transistor) and MOS (insulated gate field effect transistor), which also has MOSFET The advantages of high input impedance and low conduction voltage drop of GTR. IGBT module is a modular semiconductor product that is packaged by IGBT (insulated gate bipolar transistor chip) and FWD (freewheeling diode chip) through a specific circuit bridge; the packaged IGBT module is directly used in inverters and UPS uninterrupted On power supplies and other equipment; power modules mainly include substrates, directly coated copper substrates, power semiconductor chips and power terminals. When designing the internal connection struc...

Claims

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Application Information

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IPC IPC(8): H01L25/18
CPCH01L25/18
Inventor 张敏麻长胜聂世义王晓宝赵善麒
Owner MACMIC SCIENCE & TECHNOLOGY CO LTD