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Negative-type Photosensitive Resin Composition and Use thereof

A technology of photosensitive resin and resin composition, applied in optics, opto-mechanical equipment, instruments, etc., can solve problems such as hardness and etch resistance non-conformity, decline, etc., achieve excellent transparency, high cross-linking density, reliable Sexually stable effect

Active Publication Date: 2018-04-24
EVERLIGHT CHEMICAL INDUSTRIAL CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is currently known that the photosensitive resin composition mainly composed of acrylic resin has a hardness of ≤1H and a significant decrease in reliability to 0B after being baked and cured at 120°C; Etching resistance and other conditions have not met the current requirements

Method used

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  • Negative-type Photosensitive Resin Composition and Use thereof
  • Negative-type Photosensitive Resin Composition and Use thereof
  • Negative-type Photosensitive Resin Composition and Use thereof

Examples

Experimental program
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Effect test

Synthetic example -

[0028] Synthesis example - polysiloxane compound

[0029] In this synthesis example, polysiloxane compounds A-1 to A-5 were prepared according to the composition formula shown in Table 1 below. Wherein, the preparation method is roughly as follows.

[0030] Get siloxane monomer and propylene glycol monomethyl ether acetate (PGMEA) and stir at room temperature and slowly drop into phosphoric acid aqueous solution 54 grams (0.216 gram H 3 PO 4 dissolved in 54 grams of water), the temperature was raised to 110° C. for a condensation polymerization reaction, and the reaction time was 2 hours. After the reaction is complete, alcohol and water are removed by distillation. Table 1 shows the weight average molecular weight (MW) and polydispersity index (PDI) after synthesis.

[0031] Table 1

[0032]

[0033] TEOS: Tetraethoxysilane (Tetraethyl orthosilicate), C 8 h 20 o 4 Si, CAS No.: 78-10-4

[0034] PTMS: Phenyltrimethoxysilane (Phenyltrimethoxysilane), C 9 h 14 o 3 ...

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Abstract

A negative-type photosensitive resin composition comprises: (A) 10 to 50 by weight percent of a polysiloxane compound; (B) 0.1 to 30 by weight percent of a silicate oligomer; (C) 0. 1 to 10 by weightpercent of a photoacid generator, wherein the anionic part of the photoacid generator is composed of pentafluorophenyl borate; and (D) the balance of the solvent. Also disclosed is the use of the negative-type photosensitive resin composition.

Description

technical field [0001] The invention relates to a negative photosensitive resin composition, in particular to a negative photosensitive resin composition suitable for low temperature process. Background technique [0002] In the production process of display panels and touch panels, various photosensitive resin compositions such as positive or negative have been used as materials, and the photosensitive properties are used to pattern and harden the resin composition to form a passivation layer. Components such as protective layers or insulating layers. [0003] The transparent conductive layer (such as indium tin oxide, ITO) used as a panel component is required to achieve high transparency and high conductivity; and different from the external touch panel, the thinner embedded touch technology (On -Cell), must be operated at a lower curing temperature (eg 120°C). However, it is currently known that the photosensitive resin composition mainly composed of acrylic resin has ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/075
CPCG03F7/0752G03F7/0757
Inventor 徐淑屏林伯南蓝大钧张志毅林昭文
Owner EVERLIGHT CHEMICAL INDUSTRIAL CORPORATION