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A plastic packaging method for long line array detectors

A detector, plastic encapsulant technology, used in semiconductor/solid state device manufacturing, electrical components, circuits, etc.

Active Publication Date: 2021-04-20
THE 44TH INST OF CHINA ELECTRONICS TECH GROUP CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the other hand, the plastic-encapsulated area of ​​the product is mainly the surface of the detector and the bonding wire, and only the detector and part of the wire are protected. This design has great limitations in protecting the stability of the detector.

Method used

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  • A plastic packaging method for long line array detectors
  • A plastic packaging method for long line array detectors
  • A plastic packaging method for long line array detectors

Examples

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Embodiment Construction

[0040] The principles and features of the present invention are described below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0041] Such as figure 1 , 2 As shown, a plastic packaging method for long line array detectors comprises the following steps:

[0042] The conventional packaging of the long-line array detector 1 and the ceramic carrier 2 is completed by using the patch technology and the pressure welding technology;

[0043] Put the packaged long line detector 1 and the ceramic carrier 2 into the plastic mold 3, exposing part of the pins 6;

[0044] By adjusting the position of the installation fixture 5, the relative position of the long line detector 1 and the ceramic carrier 2 is fixed;

[0045] Finally, the plastic sealing operation of the long-line array detector 1 is completed by adding a plastic sealant 4 to the plastic m...

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Abstract

The invention relates to a plastic sealing method for a long-line array detector, which is characterized in that it comprises the following steps: using a patch process and a pressure-welding process to complete the conventional packaging of the long-line array detector and a ceramic carrier; Put the sensor and ceramic carrier into the plastic mold, exposing part of the pins; through the position adjustment of the installation fixture, the relative position of the long-line array detector and the ceramic carrier is fixed; finally, the long-line array is completed by adding plastic sealant to the plastic mold and heating and curing. The plastic sealing operation of the detector. The method of the invention has the advantages of low cost, simple process operation and high yield, and is suitable for basic scientific research and small-scale plastic packaging production of silicon-based photodetectors.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a plastic packaging method for long line array detectors. Background technique [0002] With the rapid development of wireless communication, automotive electronics and other consumer electronics products, there is a demand for miniaturization, low cost and high reliability design for microelectronic packaging technology. With its unique advantages, plastic packaging has become the mainstream of current microelectronic packaging, accounting for more than 95% of the packaging market. The wide application of plastic packaging products has also brought unprecedented development to plastic packaging. [0003] Plastic-encapsulated microcircuits have not been considered for aerospace applications because of their commercial implications. The use of plastic-encapsulated microcircuits in aerospace equipment has increased in recent years and is expected to continue to in...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/56
CPCH01L21/56
Inventor 陈于伟伍明娟唐志辉
Owner THE 44TH INST OF CHINA ELECTRONICS TECH GROUP CORP
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