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Sulfate trivalent-chromium chromeplate electroplating solution and application method thereof

An application method and technology of electroplating solution, applied in the field of sulfate trivalent chromium plating solution, can solve the problems of coating pinholes, streaks, low current efficiency and the like

Inactive Publication Date: 2018-05-15
MINNAN NORMAL UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, in the electroplating process of most chromium plating technologies, since the reduction potential of trivalent chromium is very negative, the reduction process is accompanied by intense hydrogen evolution reaction, which will cause pinholes and streaks in the plating layer, and the current efficiency is low.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] A sulfate trivalent chromium plating electroplating solution, the electroplating solution is formed by mixing the following components: main salt 60g / L, conductive salt 120g / L, brightener 0.75g / L, stabilizer 2g / L, surfactant 8g / L, complexing agent 60g / L, and the rest is water.

[0026] Specifically, the main salt is chromium sulfate.

[0027] Specifically, the conductive salt is any two or more of ammonium sulfate, sodium sulfate, and potassium sulfate.

[0028] Specifically, the brightener is polyethyleneimine, bipyridine, 2-mercaptobenzothiazole, 2-mercaptobenzimidazole, tetraisopropylammonium iodide, propynyl alcohol, butynyl alcohol, butynediol Any two or more.

[0029] Specifically, the stabilizer is hydroxylamine hydrochloride or ascorbic acid.

[0030] Specifically, the surfactant is a mixture of polyvinyl ether, polyethylene glycol, and polyvinyl alcohol.

[0031] Specifically, the complexing agent is any two or more of propionic acid, glycine, succinic aci...

Embodiment 2

[0042] A kind of sulfate trivalent chromium plating electroplating solution and application method thereof as described in embodiment 1, wherein some steps can also adopt following technology:

[0043] Described trivalent chromium plating electroplating solution is formed by mixing the following components:

[0044] Main salt 70g / L, conductive salt 80g / L, brightener 0.25g / L, stabilizer 5g / L, surfactant 4g / L, complexing agent 40g / L, and the rest is water.

[0045] In the application method of trivalent chromium plating electroplating solution:

[0046] In the step 1), the pH value is 3.6.

[0047] In the step 3), the temperature of the plating solution is 45°C.

[0048] In the step 3), the current density is 5.6A / dm².

[0049] In the step 3), the electroplating time is 70s.

Embodiment 3

[0051] A kind of sulfate trivalent chromium plating electroplating solution and application method thereof as described in embodiment 1, wherein some steps can also adopt following technology:

[0052] Described trivalent chromium plating electroplating solution is formed by mixing the following components:

[0053] Main salt 80g / L, conductive salt 40g / L, brightener 1.15g / L, stabilizer 0.2g / L, surfactant 10g / L, complexing agent 30g / L, and the rest is water.

[0054] In the application method of trivalent chromium plating electroplating solution:

[0055] In the step 1), the pH value is 2.8.

[0056] In the step 3), the temperature of the plating solution is 65°C.

[0057] In the step 3), the current density is 2.7A / dm².

[0058] In the step 3), the electroplating time is 60s.

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PUM

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Abstract

The invention provides a sulfate trivalent-chromium chromeplate electroplating solution and an application method thereof. Amine compounds and organic compounds containing nitrogen, sulfur, acetylenicalcohol and the like, which are used as brighteners, are added into a basic electroplating solution containing chromium sulfate and conducting salt; hydroxylamine hydrochloride or ascorbic acid is added for stabilizing trivalent chromium in the electroplating solution, substances such as polyethers and polyalcohols are added as surfactants, and low carbon chain material complexing agents such asoxalic acid, propionic acid, glycine and succinic acid are added for complexing trivalent chromium ions, so that the cathodic reduction of the trivalent chromium complex ions is greatly promoted, andthe tolerance of the electroplating solution to impurities and the stability of the electroplating solution are further improved; the brighteners and the surfactants also can promote the cathodic reduction of the trivalent chromium ions, and appropriate processing parameters are cooperatively set, so that the reaction effects of all components can be greatly improved; the sulfate trivalent-chromium chromeplate electroplating solution can enable plating to have excellent appearance, morphology, structure, binding force and corrosion resistance, and enables the plating not to have surface defects such as pinholes and stripes.

Description

technical field [0001] The invention relates to a sulfate trivalent chromium plating electroplating solution. Background technique [0002] At present, in the electroplating process of most chromium plating technologies, since the reduction potential of trivalent chromium is very negative, the reduction process is accompanied by intense hydrogen evolution reaction, which will cause pinholes and streaks in the plating layer, and the current efficiency is low. Contents of the invention [0003] In order to overcome the above problems, the invention provides a sulfate trivalent chromium plating solution and an application method thereof. [0004] To achieve the above object, the technical solution provided by the invention is: [0005] A sulfate trivalent chromium plating electroplating solution, the electroplating solution is mixed with the following components: main salt 25-80g / L, conductive salt 40-150 g / L, brightener 0.05-1.15g / L, stabilizer 0.2 -6g / L, surfactant 2-10g / ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/06
CPCC25D3/06
Inventor 陈国良叶金堆林珩郑子山李巧云陈棽陈焰香
Owner MINNAN NORMAL UNIV
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