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Citric acid-tartrate pre-plated copper plating solution and application method thereof

The technology of a tartrate and an application method, which is applied in the field of citric acid-tartrate pre-plating copper plating solution, can solve the problems of high production cost, insufficient appearance of electroplated parts, and unfavorable large-scale continuous production.

Inactive Publication Date: 2018-05-15
宏正(福建)化学品有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The disadvantage of the existing copper plating process is that the stability of the electroplating solution is poor, and monovalent copper deposits will be produced. The high price of foreign products is not conducive to the production cost control of enterprises, and the production cost is high

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] A citric acid-tartrate pre-plating copper plating solution, the electroplating solution is mixed by the following components: main salt 33g / L, complexing agent 81g / L, monovalent copper complexing agent 12g / L, alcohol additive 0.5 g / L, accelerator 0.32g / L, and the rest is water.

[0026] Preferably, the main salt is copper sulfate, copper chloride, copper nitrate or copper carbonate.

[0027] Preferably, the complexing agent is tartrate and potassium citrate, the content of tartrate is 65g / L, and the content of potassium citrate is 16g / L.

[0028] Preferably, the monovalent copper complexing agent is one or more of salicylic acid, potassium thiocyanide, succinimide, sulfite, and hydantoin.

[0029] Preferably, the alcohol additive is one or more of lauryl alcohol, polyvinyl alcohol, triglycerides.

[0030] More preferably, it also contains nitrogen-containing compound 0.01-0.75g / L, sulfur-containing compound 0.05-1.35g / L; the nitrogen-containing compound additive is on...

Embodiment 2

[0042] A kind of citric acid-tartrate copper pre-plating bath and application method thereof as described in embodiment 1, wherein some parts of the steps can also adopt the following process:

[0043] Described citric acid-tartrate pre-plating copper plating solution, electroplating solution is mixed by following component material:

[0044] The main salt is 25g / L, the content of tartrate is 72g / L, the content of potassium citrate is 13g / L, the monovalent copper complexing agent is 9g / L, the alcohol additive is 0.9g / L, the accelerator is 0.57g / L, and the rest is water.

[0045] In the application method of citric acid-tartrate pre-plating copper plating solution:

[0046] In the step 1), the pH value is 9.5.

[0047] In the step 3), the temperature of the plating solution is 40° C., and the current density is 2.3 A / dm².

Embodiment 3

[0049] A kind of citric acid-tartrate copper pre-plating bath and application method thereof as described in embodiment 1, wherein some parts of the steps can also adopt the following process:

[0050] Described citric acid-tartrate pre-plating copper plating solution, electroplating solution is mixed by following component material:

[0051] Main salt 60g / L, tartrate content 60g / L, potassium citrate content 17g / L, monovalent copper complexing agent 8g / L, alcohol additive 1.2g / L, accelerator 0.05g / L, the rest is water.

[0052] In the application method of citric acid-tartrate pre-plating copper plating solution:

[0053] In the step 1), the pH value is 8.5.

[0054] In the step 3), the temperature of the plating solution is 62° C., and the current density is 0.35 A / dm².

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PUM

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Abstract

The invention provides a citric acid-tartrate pre-plated copper plating solution and an application method thereof. The citric acid-tartrate pre-plated copper plating solution is characterized in thata monovalent copper complexing agent is added into a basic plating solution containing main salts and a complexing agent so as to stabilize and promote the cathodic reduction of copper ions; alcohols, nitrogen compounds and sulfur compounds are added as additives, so that the cathodic reduction of the copper ions can be inhibited, the polarization of a copper ion reduction process is improved, particles of a copper plating layer are enabled to be small, compact and bright, and pinholes and stripes are prevented from generating in the plating layer due to a surface wetting effect; a monovalentcopper reduction and oxidation promoter are added, so that copper is enabled to be successfully plated, monovalent copper precipitate is not produced, and the dissolution of anode copper is promoted;in combination of appropriate processing parameters, the reaction effects of all components can be more greatly improved, and the plating layer is enabled to have excellent appearance, shape, structure and binding force, and surface defects such as the pinholes and the stripes are avoided.

Description

technical field [0001] The invention relates to a citric acid-tartrate copper pre-plating bath and an application method thereof. Background technique [0002] The disadvantage of the existing copper plating process is that the stability of the electroplating solution is poor, and monovalent copper deposits will be produced. The high price of foreign products is not conducive to the production cost control of enterprises, and the production cost is high. Contents of the invention [0003] In order to overcome the above problems, the invention provides a citric acid-tartrate copper pre-plating bath and application method thereof. [0004] To achieve the above object, the technical solution provided by the invention is: [0005] A citric acid-tartrate copper pre-plating solution, the electroplating solution is mixed from the following components: main salt 15-60g / L, complexing agent 72-97g / L, monovalent copper complexing agent 8-15g / L L. Alcohol additive 0.01-1.2g / L, acce...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/26C25D3/28
CPCC25D3/26C25D3/28
Inventor 叶金堆陈国良林珩
Owner 宏正(福建)化学品有限公司
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