Method of manufacturing semiconductor device
A manufacturing method and semiconductor technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, transistors, etc., can solve the problem of short carrier life
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0020] figure 1 A semiconductor device 10 manufactured by the method of this embodiment is shown. The semiconductor device 10 is composed of a semiconductor substrate 12 , electrodes, insulators, and the like provided on the upper surface 12 a and the lower surface 12 b of the semiconductor substrate 12 . The semiconductor substrate 12 is made of silicon. The semiconductor substrate 12 includes an IGBT region 16 and a diode region 18 . The IGBT region 16 is adjacent to the diode region 18 when the semiconductor substrate 12 is viewed planarly along the thickness direction of the semiconductor substrate 12 . IGBTs are provided in the IGBT region 16 , and diodes are provided in the diode region 18 . That is, the semiconductor device 10 is a so-called RC-IGBT.
[0021] A plurality of grooves 40 are provided on the upper surface 12 a of the semiconductor substrate 12 . Each groove 40 is along with figure 1 The directions perpendicular to the paper surface extend parallel to ...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com