Multilayer flexible circuit board and preparation method thereof

Abstract

The invention discloses a multilayer flexible circuit board and a preparation method thereof. The multilayer flexible circuit board comprises a first substrate layer, a second substrate layer, at least two conductive circuit layers and isolation layers, wherein the first substrate layer and the second substrate layer are oppositely arranged in parallel; the at least two conductive circuit layers are formed between the first substrate layer and the second substrate layer, the at least two conductive circuit layers are parallel to each other, and each conductive circuit layer comprises a plurality of conductive circuits arranged at intervals; and the isolation layer is arranged between each two adjacent conductive circuit layers, each isolation layer is provided with through holes so as to enable the conductive circuits at two sides of an isolation plate to be electrically connected through the corresponding through hole. According to the invention, a flexible thin film is adopted to serve as the first substrate layer, the second substrate layer and the isolation layers, the conductive circuits are prepared by adopting a graphic printing technology, and the multiple layers of the isolation plates are adhered through an adhesive layer, so that the multilayer flexible circuit board has the characteristics of high smoothness, good flexibility and thin thickness, is better in flexibility and thermal expansion performance and is applicable to flexible and thin type equipment.

Description

technical field [0001] The invention belongs to the technical field of multilayer circuit boards, and in particular relates to a multilayer flexible circuit board and a preparation method thereof. Background technique [0002] Multilayer circuit board is the most basic electronic component in modern electronic equipment, which plays the role of connecting and carrying electronic components. With the continuous development of electronic technology, circuit boards are gradually developing towards high density and flexibility. (1) High density, the line width and line spacing of conductive lines are continuously reduced, the wiring is continuously dense, and the number of layers of circuit boards is also increasing; (2) Flexibility, using flexible films as circuit board substrates to realize The performance of winding and bending of conductive lines. [0003] However, the current flexible circuit boards basically use polyimide as the base material and are produced using tradi...

AI Technical Summary

Problems solved by technology

[0004] Due to some limitations in the current process, equipment and technology of flexible circuit boards, there are still certain difficulties in the preparation of thin and light multi-layer flexible circuits, which restricts the development of light and thin products to a certain extent.

Images