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Dimensionally stable oxazolyl polyimide film and preparation method thereof

A type of oxazole-based polyimide and dimensionally stable technology, which is applied in the field of dimensionally stable oxazole-based polyimide film and its preparation, can solve the problems of film dimensional stability change, peeling, and water absorption increase. Achieve long-lasting dimensional stability and high tensile strength

Active Publication Date: 2018-06-05
GUILIN ELECTRICAL EQUIP SCI RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, excessive use of p-phenylenediamine will increase the water absorption rate. When the water absorption rate is higher than 2%, the flexible copper-clad laminate will produce bubbles or peeling when it is subjected to a high temperature of 250-300 ° C during the graphic production process. At the same time also lead to changes in the dimensional stability of the film

Method used

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  • Dimensionally stable oxazolyl polyimide film and preparation method thereof
  • Dimensionally stable oxazolyl polyimide film and preparation method thereof
  • Dimensionally stable oxazolyl polyimide film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Add 10mol PDA, 20mol BZA and 70mol ODA to 168kg DMAc, stir for 0.5h, add 50molPMDA, react for 1h, then add 39.6mol PMDA, react for 1h, finally add 10mol BPDA, react for 5h to obtain a polyamic acid resin solution. After the polyamic acid resin solution is defoamed, it is extruded on a steel belt through a die head, and the solvent is removed by heating (160°C) to obtain a self-supporting film, which is then biaxially stretched and thermally imidized at 400°C to obtain a dimensionally stable film. Type oxazole-based polyimide film.

Embodiment 2

[0025] Repeat Example 1, the difference is that the amount of DMAc added is 165 kg, the amount of PDA added is 20 mol, and the amount of ODA added is 60 mol.

Embodiment 3

[0027] Repeat Example 1, the difference is that the amount of DMAc added is 161 kg, the amount of PDA added is 30 mol, and the amount of ODA added is 50 mol.

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Abstract

The invention discloses a dimensionally stable oxazolyl polyimide film and a preparation method thereof. The dimensionally stable oxazolyl polyimide film is prepared by the steps of carrying out polymerization reaction on aromatic diamine and aromatic dianhydride in a polar aprotic solvent, and carrying out salivation and thermal imidization on an obtained polyamide acid resin solution, wherein aromatic diamine contains the following components in percentage by weight: 10%-30% of p-phenylenediamine, 5%-40% of 2-(4-aminophenyl)-5-amino benzoxazole and the balance of 4,4',-diaminodiphenyl ether,and aromatic dianhydride contains the following components in percentage by weight: 3,3',4,4'-biphenyl tetracarboxylic dianhydride and the balance of pyromellitic acid dianhydride. The dimensionallystable oxazolyl polyimide film prepared from the raw material in parts by weight has excellent dimensional stability, and meanwhile, the water absorption rate of the film is less than 2%.

Description

technical field [0001] The invention relates to a polyimide film, in particular to a dimensionally stable oxazole-based polyimide film and a preparation method thereof. Background technique [0002] With the rapid development of electronic products in the direction of thin, light and short, the flexible printed circuit board market is rapidly expanding. As an important insulating substrate for flexible printed circuit boards, the demand for polyimide (PI) film is also increasing year by year. , the requirements for dimensional stability are getting higher and higher, mainly reflected in the indicators of thermal expansion coefficient, elastic modulus, thermal shrinkage rate and water absorption rate, that is, the thermal expansion coefficient of PI film is required to be close to 18ppm / ℃ of copper foil, and the elasticity The modulus is between 4.0 and 5.5GPa, the thermal shrinkage rate is <0.05%, and the water absorption rate is <2.0%. In the prior art, there are rel...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18C08G73/10C08L79/08
CPCC08G73/1071C08J5/18C08J2379/08C08L79/08C08L2203/16
Inventor 青双桂冯羽风白小庆蒋耿杰
Owner GUILIN ELECTRICAL EQUIP SCI RES INST
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