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E glass fiber paper for CEM-3 copper-clad plate and manufacturing method of E glass fiber paper

A glass fiber paper and glass fiber technology, applied in the direction of synthetic cellulose/non-cellulose material pulp/paper, non-fiber pulp addition, fiber raw material treatment, etc., can solve problems not related to the E-glass fiber paper process, etc. Achieve the effect of white appearance, good compatibility and good dimensional stability

Active Publication Date: 2018-06-08
陕西华特新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0013] None of the above-mentioned inventions involves the process of making E-glass fiber paper after water-based epoxy resin is used

Method used

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  • E glass fiber paper for CEM-3 copper-clad plate and manufacturing method of E glass fiber paper
  • E glass fiber paper for CEM-3 copper-clad plate and manufacturing method of E glass fiber paper
  • E glass fiber paper for CEM-3 copper-clad plate and manufacturing method of E glass fiber paper

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Embodiment Construction

[0064] This embodiment is an E-glass fiber paper for CEM-3 copper clad board, which is composed of glass fiber and binder, wherein the glass fiber is 87%-91%, and the binder is 9%-13% ; The percentages stated are percentages by weight. The adhesive is epoxy resin.

[0065] This embodiment also proposes a method for preparing the E glass fiber paper used for CEM-3 copper clad board, the specific process is:

[0066] Step 1, prepare white water.

[0067] The raw materials for preparing white water are thickener, dispersant, defoamer and deionized water. Among them, the thickener is 0.1-0.16%, the dispersant is 0.01%, and the deionized water is more than 99.8%. The content of the defoamer is added according to the amount of foam in the prepared white water to eliminate the foam.

[0068] Described thickening agent is hydroxyethyl cellulose ether, adopts the product of Union Carbide Company of the United States. The pH value of the aqueous solution is 6.0-8.5.

[0069] The d...

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Abstract

The invention provides E glass fiber paper for a CEM-3 copper-clad plate and a manufacturing method of the E glass fiber paper. The E glass fiber paper is composed of glass fibers and an adhesive. Cut-short glass fibers are dispersed in white water prepared from deionized water, a glass fiber dispersing agent, a thickening agent, a defoaming agent and other chemical auxiliaries, the glass fibers are scooped out of the white water to form wet ground paper, chemical adhesives and auxiliaries are applied for adhesion, drying through a drying furnace is conducted, the adhesives are solidified, andthe E glass fiber paper for the CEM-3 copper-clad plate is formed. The cut-short glass fibers are E glass fibers of the electronic level. The E glass fibers prepared from the method are uniform in fiber dispersing, stable in gram weight and consistent in thickness; the fibers are high in tensile strength, high in solvent resistance and high in fiber porosity due to all-direction distribution, a large amount of dielectric filler can be added when the glass fibers are soaked in epoxy resin, and the glass fibers are a high-quality base material for manufacturing the CEM-3 copper-clad plate.

Description

technical field [0001] The invention relates to a method for making E glass fiber paper used for CEM-3 copper clad boards. Background technique [0002] Copper-clad laminate is the basic material of printed circuit boards. Copper-clad laminates are generally made of cotton pulp paper, glass fiber cloth impregnated with phenolic, polyester, and epoxy resin, then pressed with copper foil, that is, FR4 copper-clad laminate. Later, glass fiber paper was impregnated with resin and fillers were added to make core material composite glass fiber cloth impregnated with resin and covered with copper foil to make plate, that is, composite substrate CEM-3 copper clad laminate. Patents CN202053608U, CN201797646U, and CN102029746A all introduced this method. E-glass fiber paper is the base material of CEM-3 composite base copper clad laminate for printed circuit boards. Among all types of copper clad laminates, FR-4 based on glass fiber cloth has the best performance. CEM-3 has the same...

Claims

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Application Information

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IPC IPC(8): D21F1/66D21H15/02D21H13/40D21H15/10D21H17/52D21H17/13D21H17/36D21H17/35D21H17/57D21H17/51D21H17/37
CPCD21F1/66D21H13/40D21H15/02D21H15/10D21H17/13D21H17/35D21H17/36D21H17/37D21H17/51D21H17/52D21H17/57
Inventor 王克谦樊彩兰成伟波程登智李文华
Owner 陕西华特新材料股份有限公司
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