Circuit board and fabrication method thereof

Abstract

The invention relates to a fabrication method of a circuit board. The fabrication method comprises the following steps of processing a first circuit layer on a circuit core board; laminating a capacitance core board, a first insulation plate and the circuit core board to obtain a son board; etching a metal layer at an outer side of the capacitance core board in the son board to obtain a second circuit layer; and laminating the son board, a second insulation layer and a mother board to obtain the circuit board. The capacitance core board and the circuit core board are laminated, the capacitancecore board and the circuit core board are laminated integrally, a dielectric layer, the metal layer at the other side of the capacitance core board, the first insulation board and the circuit core board are integrated, and the thickness of the dielectric layer is equivalently increased; during processing of the second circuit layer of the metal layer at the outer side of the capacitance core board, damage caused by difficult operation such as exposure and developing to the dielectric layer is generated, the finished rate during the processing of the capacitance core board is ensured, and theproduction cost is reduced; and compared with a traditional mode of etching the metal layers at two sides of a front surface and a rear surface, the fabrication method has the advantages that the process is reduced, and the production cost is further reduced.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a circuit board and a manufacturing method thereof. Background technique [0002] The structure of the embedded capacitor is similar to that of the parallel plate capacitor. There are metal layers on both sides, and a thin dielectric layer with high dielectric constant (DK) and low dielectric loss in the middle. The thickness of the dielectric layer is usually between 10 μm and 20 μm. Thus, the capacitance is greatly improved, and the thickness of the dielectric layer with large capacitance is thinner, usually between 3μm-12μm, or even thinner. Embedding the capacitor plate in the substrate not only reduces the board space of the circuit board, but also improves the capacitance performance. , also improves the degree of circuit miniaturization. [0003] The processing of the existing capacitor plate is usually carried out by etching the two metal layers separate...

AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to provide a circuit board and its manufacturing method for the problem that the dielectric layer is easily broken when the capacitor board is processed.

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