Epoxy resin composition, film-shaped epoxy resin composition, and electronic device

A technology of epoxy resin and composition, applied in circuits, electrical components, electrical solid devices, etc., can solve the problem of unfilled parts, achieve warpage suppression, excellent heat resistance and flame retardancy, and excellent handleability Effect

Active Publication Date: 2018-06-08
株式会社力森诺科
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since molten resin is cast and molded, when sealing a large area, unfilled parts may occur

Method used

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  • Epoxy resin composition, film-shaped epoxy resin composition, and electronic device
  • Epoxy resin composition, film-shaped epoxy resin composition, and electronic device
  • Epoxy resin composition, film-shaped epoxy resin composition, and electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～5 and comparative example 1～4、6

[0123] (Production of film-like epoxy resin composition)

[0124] The compounds shown in Table 1 and Table 2 were prepared as components constituting the film-like epoxy resin composition. The details of each component are as follows.

[0125] (A) epoxy resin

[0126] [Components that are liquid at 25°C]

[0127] A1: Bisphenol F-type epoxy resin (epoxy equivalent: 160, manufactured by Mitsubishi Chemical Corporation, trade name "jER806")

[0128] A2: bifunctional naphthalene-type epoxy resin (epoxy equivalent: 141, manufactured by DIC Corporation, trade name "HP-4032D", compound represented by the following formula)

[0129] [chemical 9]

[0130]

[0131] [Components that are not liquid at 25°C]

[0132] A3: Trifunctional naphthalene-type epoxy resin (epoxy equivalent: 182, manufactured by DIC Corporation, trade name "HP-4750", compound represented by formula (IV))

[0133] (B) Resin with aromatic ring and hydroxyl group

[0134] [Resin having naphthalene ring and hy...

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Abstract

The present invention relates to an epoxy resin composition containing an epoxy resin (A), a resin (B) having an aromatic ring and a hydroxyl group, silicone powder (C), a curing accelerator (D), andan inorganic filler (E), the epoxy resin (A) including an epoxy resin which is liquid at 25 DEG C, the resin (B) having an aromatic ring and a hydroxyl group including a resin having a naphthalene ring and a hydroxyl group, the content of the epoxy resin which is liquid at 25 DEG C being 32% by mass on the basis of the total quantity of the epoxy resin (A) and the resin (B) having an aromatic ringand a hydroxyl group, and the content of the silicone powder (C) being 0.80-7.30% by mass on the basis of the total quantity of the epoxy resin composition (excluding the solvent in a case in which the epoxy resin composition contains a solvent).

Description

technical field [0001] The invention relates to an epoxy resin composition, a film-like epoxy resin composition and an electronic device. The present invention relates to an epoxy resin composition and a film-like epoxy resin composition capable of embedding or sealing electronic parts or electronic devices (for example, electronic parts or electronic devices disposed on a printed wiring board), and their use of electronic devices. Background technique [0002] Along with thinner, thinner and smaller electronic equipment, miniaturization and thinning of semiconductor devices are progressing. The form of using a semiconductor device that is almost the same size as a semiconductor element, or the form of mounting a semiconductor device on a semiconductor device (Package on Package, stacked package) is prevailing, and it is expected that the miniaturization and thinning of semiconductor devices will further progress in the future. [0003] If semiconductor elements are furthe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/62C08K3/00C08L63/00C08L83/04H01L23/29H01L23/31
CPCC08G59/62C08K3/00C08L63/00C08L83/04H01L23/29H01L23/31C08J5/18C08L65/00
Inventor 荻原弘邦野村丰渡濑裕介铃木雅彦鸟羽正也藤本大辅金子知世
Owner 株式会社力森诺科
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