Manufacturing method of polyimide film and manufacturing method of graphite film using the same

A technology of polyimide film and manufacturing method, applied in chemical instruments and methods, inorganic chemistry, non-metallic elements, etc., can solve the problems of insufficient thermal conductivity of heat dissipation materials, achieve excellent thermal conductivity, and solve the effect of insufficient thermal conductivity

Inactive Publication Date: 2018-06-12
MORTECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The invention provides a method for manufacturing a polyimide film and a method for manufacturing a graphite film using the same, in particular a method for manufacturing a polyimide film, and using the polyimide film t

Method used

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  • Manufacturing method of polyimide film and manufacturing method of graphite film using the same
  • Manufacturing method of polyimide film and manufacturing method of graphite film using the same
  • Manufacturing method of polyimide film and manufacturing method of graphite film using the same

Examples

Experimental program
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Effect test

Embodiment 1

[0048] First, 24.06 g of 4,4'-diaminodiphenyl ether (ODA) and 1.5 g of N,N-dimethylcyclohexylamine as a catalyst were added to 198.5 g of dimethylacetamide (DMAc) and stirred for 0.5 hours , ODA and N,N-dimethylcyclohexylamine were uniformly dissolved in DMAc to form a diamine solution containing a catalyst.

[0049] Next, 25.94 g of pyromellitic dianhydride (PMDA) was slowly added into the diamine solution containing the catalyst and stirred at room temperature for 6 hours to make the PMDA and ODA react to form a polyamic acid solution containing the catalyst. Wherein, the weight percentage of the catalyst N,N-dimethylcyclohexylamine relative to the total weight of ODA and PMDA is 3%.

[0050] Next, coat the polyamic acid solution containing the catalyst on the additional circuit board, and heat and dry the polyamic acid solution containing the catalyst at 120° C. for 10 minutes to form a polyamic acid film containing the catalyst on the additional circuit board. The catalys...

Embodiment 2

[0055] Embodiment two is similar to embodiment one, and its difference is that in embodiment two, the weight of catalyst N,N-dimethylcyclohexylamine is 2.5 grams, and catalyst N,N-dimethylcyclohexylamine is relative to ODA and PMDA total The weight percentage is 5%, and the weight of the solvent DMAc is 197.5 grams.

Embodiment 3

[0057] Embodiment three is similar to embodiment one, and its difference is that in embodiment three, the weight of catalyzer triethylenediamine (DABCO) is 1.5 grams, and the percentage by weight of catalyzer DABCO relative to ODA and PMDA gross weight is 3%, the weight of solvent DMAc for 200 grams.

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Abstract

The present invention discloses a method for producing a graphite film by using a method for producing a polyimide film. According to the method, firstly, a diamine, a solvent and a catalyst are mixedup to form a diamine solution containing a catalyst. Next, a tetracarboxylic dianhydride and a catalyst-containing diamine solution are mixed to form a catalyst-containing polyamic acid solution. Next, the polyamic acid solution containing a catalyst is heated to form a polyamic acid film containing a catalyst. Next, a polyamic acid film containing a catalyst is imidized to form a polyimide film.Finally, the polyimide film is heated to form a graphite film. The step of imidizing the polyamic acid film containing the catalyst to form a polyimide film is catalyzed by a catalyst, and the catalyst is a tertiary amine.

Description

technical field [0001] The present invention relates to a method for manufacturing a polyimide film and a method for manufacturing a graphite film using it, in particular a method for manufacturing a polyimide film that can be used to manufacture a graphite film with excellent thermal conductivity, And the manufacturing method of using the polyimide film to manufacture graphite film with excellent thermal conductivity. Background technique [0002] With the rapid improvement of the performance of electronic products, how to meet the heat dissipation requirements of electronic products has become an important issue. The heat dissipation material or heat conduction material used in general electronic products is copper, and the thermal conductivity coefficient of copper is about 400W / m-K. The heat dissipation material or heat conduction material often used in electronic products with lightweight requirements is aluminum, and the thermal conductivity of aluminum is about 200W / ...

Claims

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Application Information

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IPC IPC(8): C08G73/10C08J5/18C01B32/205C08L79/08
CPCC08G73/1071C08J5/18C08J2379/08
Inventor 孙德峥许艳惠陈启盛李国维
Owner MORTECH CORP
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