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Grinding pad and manufacturing method thereof

A manufacturing method and a technology for grinding pads, which are applied in the directions of grinding tools, chemical instruments and methods, abrasives, etc., to achieve the effect of improving grinding performance and improving productivity

Active Publication Date: 2018-06-15
MCK 股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] However, the technology disclosed in Korean Laid-Open Patent No. 2003-0063944 still requires the use of slurry, and the technology disclosed in Korean Laid-Open Patent No. 2002-0033203 still requires an adjustment step

Method used

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  • Grinding pad and manufacturing method thereof
  • Grinding pad and manufacturing method thereof
  • Grinding pad and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0113] Embodiment 1. the first grinding body is made

[0114] The first fine particle abrasive material as diamond and the water-soluble solvent are mixed with a ball mill, whereby dispersion is performed without flocculation phenomenon. The dispersed first particulate abrasive material is dried to evaporate the solvent, thereby obtaining the first particulate abrasive material powder.

[0115] Moreover, polyvinyl alcohol (PVA) with a weight average molecular weight of 40,000, polyethylene glycol (PEG) with a weight average molecular weight of 2,000, and dextrin (Dextrin) with a weight average molecular weight of 2,000 and a water-soluble solvent are mixed to make a polymer adhesive. Binder. Wherein, relative to 100 parts by weight of the above-mentioned first particulate abrasive material, the above-mentioned polyvinyl alcohol (PVA) contains 4 parts by weight, polyethylene glycol contains 3 parts by weight, and dextrin contains 3 parts by weight to make a polymer binder.

...

Embodiment 2

[0117] Embodiment 2. the first grinding body is made

[0118] A first abrasive body was produced by the same method as in Example 1 except that 100 parts by weight of silica powder was mixed with respect to the first particulate abrasive material.

Embodiment 3

[0119] Embodiment 3. the first grinding body is made

[0120] A first abrasive body was produced by the same method as in Example 1 except that 200 parts by weight of silica powder was mixed with respect to the first particulate abrasive material.

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PUM

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Abstract

The invention relates to a grinding pad and a manufacturing method of the grinding pad, and is characterized in that when the grinding process is carried out, a slurry is not required to be used, or agrinding pad in an adjusting procedure and other manufacturing methods are not required. The grinding pad is formed by a self-adjusting forming body coating with waterborne polyurethane, the dissolution rate can be controlled. When the grinding process of the grinded body is carried out, extra slurry does not need to be used, and additional adjustment procedures do not need to be carried out. Idle time of the device is avoided, and the production performance of the grinding process can be improved. The grinding pad comprises grinding auxiliary materials, so that the grinding performance is improved.

Description

technical field [0001] The present invention relates to a polishing pad and a manufacturing method thereof, and more specifically, to a polishing pad and other manufacturing methods that do not require the use of slurry and / or the need for a conditioning process during the polishing process. Background technique [0002] Sodalime glass (Sodalime glass), borosilicate glass (Borosilicate glass), aluminosilicate glass (Aluminosilicate glass), quartz (Quartz ) and other materials to form flat optical glass substrates, sapphire (Sapphire), silicon carbide (SiC), zirconia (Zirconia) wafer substrates, including grinding (Grinding), lapping (Lapping), polishing (Polishing) and finishing (Finishing) and other grinding processes are one of the core processes. [0003] The polishing step adjusts the thickness of the substrate of the object to be polished, or the surface roughness (Surface Roughness) of the substrate surface. [0004] Grinding is a step that mainly reduces the thickne...

Claims

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Application Information

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IPC IPC(8): B24D3/22
CPCB24D3/22B24B37/24C08L75/04C08L101/00C09K3/1409C09K3/1436
Inventor 文德柱赵始衡朴晟镐朴兑镇徐荣吉
Owner MCK 股份有限公司
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