Airborne mist spraying cooling system using radiant plate cooling circulation water

Abstract

The invention discloses an airborne mist spraying cooling system using radiant plate cooling circulation water and belongs to the field of airborne high heating flux equipment. The airborne mist spraying cooling system using radiant plate cooling circulation water is mainly used for solving the problem about continuous heat radiation of high heating flux surfaces such as an airborne radar chip anda laser weapon. The airborne mist spraying cooling system using radiant plate cooling circulation water mainly comprises a water tank (1), a water pump (2), a flow adjustment valve (3), a stop valve(4), a flow meter (5), a mist spraying chamber (6), a spraying nozzle (7), a to-be-cooled surface (8), a copper pipe (9), a fan (10), a radiation plate heat exchanger (11), a sealing layer (12), a heat preservation layer (13), a plastic supporting grid (14), and a heat preservation device contraction switch (15). Mist spraying cooling is conducted on the surface of airborne electronic equipment through latent heat of vaporization of water in the mist spraying chamber, the heat of the surface of the high temperature electronic equipment is taken away through a high altitude low-temperature coldsource by using the radiation plate heat exchanger, and the closed type system is safe, is stable and saves energy when operating, and meets the cooling requirement in an airborne complex thermal environment.

Description

technical field [0001] The invention relates to an airborne spray cooling system using a radiant plate to cool circulating water, and belongs to the field of airborne high heat flux equipment cooling. Background technique [0002] With the rapid development of airborne radar technology, power amplifier chips have developed from silicon chips and GaAs chips to the third-generation semiconductor GaN chips. Several projects of the U.S. Navy and Air Force have shown that the heat flux density of GaN chips under research has reached 500W / cm 2 , the heat flux density of future chips will exceed 1000W / cm 2 . At the same time, with the continuous improvement of military aircraft maneuverability, stealth performance, and defense performance requirements, technologies such as high-power laser technology, high integration and miniaturization of electronic components have been developed rapidly. Laser weapons will generate megawatt-level heat within a few seconds of firing, resulting...

AI Technical Summary

Problems solved by technology

Some patents have proposed the application method of spray cooling in the airborne field. For example, patent ZL201510072716.7 proposes a cooling system based on air expansion refrigeration for airborne heating elements. The main feature is the use of turbines as refrigeration devices and power sources. When this solution is put into use, the turbine cooling storage must be used first for spray cooling, and the storage time is long, so it cannot be put into use at any time; the structure is complex and the equipment space is large, and it is difficult to install on military aircraft

Patent CN201611007244.8 proposes a comprehensive thermal management system using onboard evaporative cycle refrigeration and its method and application. The main feature is that the evaporative refrigeration cycle is used to provide an indirect cold source for the system. After adding the evaporative refrigeration cycle, the volume and energy consumption are very large , does not meet the requirements for weight reduction and energy conservation under airborne conditions

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