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Packaging method and structure of ZnMgO solar-blind ultraviolet detector

A technology of ultraviolet detector and packaging method, which is applied in semiconductor devices, sustainable manufacturing/processing, electrical components, etc., can solve the problem of the chip being unable to be practical, and achieve the effects of convenient and fast preparation, extended use range, and simple process

Active Publication Date: 2018-06-15
CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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  • Application Information

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Problems solved by technology

[0006] In view of this, the present invention provides a packaging method and packaging structure of a ZnMgO solar-blind ultraviolet detector to solve the problem that the ZnMgO solar-blind ultraviolet detector chip cannot be practical in the prior art

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  • Packaging method and structure of ZnMgO solar-blind ultraviolet detector
  • Packaging method and structure of ZnMgO solar-blind ultraviolet detector
  • Packaging method and structure of ZnMgO solar-blind ultraviolet detector

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Embodiment Construction

[0065] As mentioned in the background technology section, the ZnMgO solar-blind ultraviolet detectors in the prior art are mainly used in laboratories, basically only in the chip stage, and there is no packaging structure, so they cannot be widely used.

[0066] There are already some electronic device packaging methods in the prior art, most of which use gold wire ball bonding technology to bond the electrodes on the chip and the pins on the shell with gold wires. Then cover the metal case with a quartz plate.

[0067] The inventors found that although this method is widely used, there are certain problems. First, this method has certain requirements for welding equipment and welding technology. Second, there are also requirements for the firmness and thickness of the gold electrodes on the chip. If the gold electrodes are not strong enough or are too thin, the gold electrodes may peel off during the gold wire ball bonding process. Third, the use of metal shells and quartz ...

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Abstract

The application provides a packaging method and structure of a ZnMgO solar-blind ultraviolet detector. A ZnMgO solar-blind ultraviolet detector chip is fixed on a pedestal; an interdigital electrode is lead out by a metal wire as a pin of a packaging structure of a ZnMgO solar-blind ultraviolet detector; the ZnMgO solar-blind ultraviolet detector chip is packaged by using a packaging adhesive through which ultraviolet light can pass and the exposed metal wire and connection part are packaged by using epoxy resin, thereby forming a complete packaging method of the ZnMgO solar-blind ultravioletdetector. Therefore, the ZnMgO solar-blind ultraviolet detector chip can be applied beyond the laboratory and the application range of the ZnMgO solar-blind ultraviolet detector chip is extended, so that practicability of the ZnMgO solar-blind ultraviolet detector chip is enhanced. When the device is exposed in air in use, the performance parameters are stable; and because of the led-out pin, theplug-and-play effect is realized; and a defect that the chip that is not packaged only can be tested in a lab is overcome.

Description

technical field [0001] The invention belongs to the technical field of semiconductor photodetector manufacture, and in particular relates to a packaging method and packaging structure of a ZnMgO solar-blind ultraviolet detector. Background technique [0002] Ultraviolet detection technology can be used in military communications, missile tail flame detection, fire early warning, environmental monitoring, biological effects, etc., and has a wide range of applications in both military and civilian applications. Due to the strong absorption of the atmosphere, ultraviolet rays with a wavelength below 280nm in solar radiation are almost non-existent on the surface of the earth. This ultraviolet band is vividly called the solar blind band. The solar-blind ultraviolet detector working in this band is not interfered by solar radiation, has higher sensitivity, and has outstanding advantages in weak signal detection. [0003] At present, the ultraviolet detectors that have been put i...

Claims

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Application Information

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IPC IPC(8): H01L31/18H01L31/02H01L31/0203H01L31/09
CPCH01L31/02002H01L31/0203H01L31/09H01L31/1832Y02P70/50
Inventor 陈星刘可为李炳辉张振中申德振
Owner CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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