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A kind of encapsulation method and encapsulation structure of znmgo sun-blind ultraviolet detector

A technology of ultraviolet detector and packaging method, which is applied in semiconductor devices, sustainable manufacturing/processing, climate sustainability, etc. Effect

Active Publication Date: 2019-12-24
CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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Problems solved by technology

[0006] In view of this, the present invention provides a packaging method and packaging structure of a ZnMgO solar-blind ultraviolet detector to solve the problem that the ZnMgO solar-blind ultraviolet detector chip cannot be practical in the prior art

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  • A kind of encapsulation method and encapsulation structure of znmgo sun-blind ultraviolet detector
  • A kind of encapsulation method and encapsulation structure of znmgo sun-blind ultraviolet detector
  • A kind of encapsulation method and encapsulation structure of znmgo sun-blind ultraviolet detector

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Embodiment Construction

[0065] As mentioned in the background technology section, the ZnMgO solar-blind ultraviolet detectors in the prior art are mainly used in laboratories, basically only in the chip stage, and there is no packaging structure, so they cannot be widely used.

[0066] There are already some electronic device packaging methods in the prior art, most of which use gold wire ball bonding technology to bond the electrodes on the chip and the pins on the shell with gold wires. Then cover the metal case with a quartz plate.

[0067] The inventors found that although this method is widely used, there are certain problems. First, this method has certain requirements for welding equipment and welding technology. Second, there are also requirements for the firmness and thickness of the gold electrodes on the chip. If the gold electrodes are not strong enough or are too thin, the gold electrodes may peel off during the gold wire ball bonding process. Third, the use of metal shells and quartz ...

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Abstract

This application provides a packaging method and packaging structure of a ZnMgO solar-blind ultraviolet detector. The chip of the ZnMgO solar-blind ultraviolet detector is fixed on the base, and the interdigitated electrodes are led out by metal wires as the packaging structure of the ZnMgO solar-blind ultraviolet detector. Then package the ZnMgO solar-blind UV detector chip with UV-permeable packaging glue, and use epoxy resin to package the exposed metal wires and connecting parts to form a complete ZnMgO solar-blind UV detector package The structure is convenient for use in areas outside the laboratory, and the application range of the ZnMgO solar-blind ultraviolet detector chip is expanded, making the ZnMgO solar-blind ultraviolet detector chip more practical. The performance parameters are stable when the device is used exposed to the atmosphere. The pins drawn out at the same time make the device plug and play, overcoming the weakness that unpackaged chips can only be tested in the laboratory.

Description

technical field [0001] The invention belongs to the technical field of semiconductor photodetector manufacture, and in particular relates to a packaging method and packaging structure of a ZnMgO solar-blind ultraviolet detector. Background technique [0002] Ultraviolet detection technology can be used in military communications, missile tail flame detection, fire early warning, environmental monitoring, biological effects, etc., and has a wide range of applications in both military and civilian applications. Due to the strong absorption of the atmosphere, ultraviolet rays with a wavelength below 280nm in solar radiation are almost non-existent on the surface of the earth. This ultraviolet band is vividly called the solar blind band. The solar-blind ultraviolet detector working in this band is not interfered by solar radiation, has higher sensitivity, and has outstanding advantages in weak signal detection. [0003] At present, the ultraviolet detectors that have been put i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L31/18H01L31/02H01L31/0203H01L31/09
CPCH01L31/02002H01L31/0203H01L31/09H01L31/1832Y02P70/50
Inventor 陈星刘可为李炳辉张振中申德振
Owner CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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