Process control method and film thickness acquisition method of organic solder protection film
A technology of organic solder protection film and acquisition method, which is applied in the field of circuit board processing, and can solve the problems of poor film thickness process control and long time-consuming film thickness acquisition.
Active Publication Date: 2020-11-17
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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Problems solved by technology
[0005] Based on this, it is necessary to provide a process control method and a film thickness acquisition method of organic solder protection film for the problems of long time-consuming acquisition of organic solder protection film film thickness and poor film thickness process control
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[0033] Embodiments of the present invention are described in detail below in conjunction with accompanying drawings:
[0034]It should be noted that when an element is “fixed” to another element, it may be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only and are not intended to represent the only embodiments.
[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terminology used herein in the descript...
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The invention relates to an organic solderability preservative thickness acquisition method. The method comprises the following steps: (1) a first organic solderability preservative is processed on asubstrate unit, different film thickness specifications are processed, and a first organic solderability preservative thickness is recorded; (2) the carbon content of the first organic solderability preservative is acquired; (3) based on the steps (1) and (2), the corresponding relationship between the thickness and the carbon content of the first organic solderability preservative is built; (4) the carbon content of a second organic solderability preservative on a to-be-measured substrate is acquired; and (5) the carbon content of the second organic solderability preservative is used for calculation to obtain the thickness of the second organic solderability preservative. Through building the corresponding relationship between the thickness and the carbon content of the first organic solderability preservative, as long as the carbon content of the second organic solderability preservative is acquired, the corresponding relationship between the thickness and the carbon content can be used to calculate the thickness of the second organic solderability preservative, the thickness acquisition method is simple and convenient, consumed time is short, and process control on production and processing on the organic solderability preservative on a production line is facilitated.
Description
technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a process control method and a film thickness acquisition method of an organic solder protection film. Background technique [0002] OSP is the abbreviation of Organic Solderability Preservatives. It is translated as Organic Solderability Preservatives in Chinese, also known as copper protection agent, and it is also called Preflux in English. Simply put, OSP is a layer of organic film chemically grown on a clean bare copper surface. The film has the characteristics of anti-oxidation, thermal shock resistance, moisture resistance, etc., and is used to protect the copper surface from rusting (oxidation or vulcanization, etc.) in a normal environment; but in the subsequent welding high temperature, the film must be easy It is quickly removed by flux, so that the exposed clean copper surface can be immediately combined with molten solder to form a firm solder joint...
Claims
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IPC IPC(8): G01B11/06G01N21/33
CPCG01B11/0616G01N21/33
Inventor 陈黎阳郭耀强乔书晓
Owner GUANGZHOU FASTPRINT CIRCUIT TECH