Epoxy resin composition for high heat-resisting aluminum substrate as well as preparation method and application of epoxy resin composition

A technology of epoxy resin and novolac epoxy resin, which is applied in the direction of circuit substrate materials, printed circuit components, etc., can solve the problem of poor heat resistance of aluminum substrates, and meet the requirements of heat resistance and high heat resistance Performance and the effect of guaranteeing reliability

Inactive Publication Date: 2018-06-22
纽宝力精化(广州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The aluminum substrate generally uses bisphenol A epoxy resin to react with the c

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0023] Example 1:

[0024] 1. Formula of epoxy resin composition for high heat resistance aluminum substrate

[0025] Weigh the components according to the following parts by weight: 55 parts of bisphenol A novolac epoxy resin, 20 parts of phenolic resin KPH-L2002 (purchased from Kolon Chemical); 17 parts of diluent acetone.

[0026] The hydrolyzed chlorine content of the bisphenol A novolac epoxy resin (NPPN-438) is less than 300 ppm, and the epoxy value is 4.7-5.3 eq / kg.

[0027] 2. Preparation process of epoxy resin composition for high heat resistance aluminum substrate

[0028] The preparation process of the epoxy resin composition for high heat resistance aluminum substrates of the present invention includes the following steps:

[0029] S1. Weigh each component of the formula;

[0030] S2. The phenolic epoxy resin and the phenolic resin are added to the diluent, heated and stirred at 50°C until the dissolution is complete, cooled to room temperature, and stirred evenly and filtered...

Example Embodiment

[0035] Example 2:

[0036] 1. Formula of epoxy resin composition for high heat resistance aluminum substrate

[0037] Weigh the components as follows: 65 parts of bisphenol A novolac epoxy resin, 24 parts of phenolic resin KPH-L2002 (purchased from Kolon Chemical), and 21 parts of diluent acetone. Wherein: the hydrolyzed chlorine content of the bisphenol A type novolac epoxy resin (NPPN-438) is less than 300 ppm, and the epoxy value is 4.7-5.3 eq / kg.

[0038] 2. Preparation process of epoxy resin composition for high heat resistance aluminum substrate

[0039] The preparation process of the epoxy resin composition for high heat resistance aluminum substrates of the present invention includes the following steps:

[0040] S1. Weigh each component of the formula;

[0041] S2. The phenolic epoxy resin and the phenolic resin are added to the diluent, heated and stirred at 50°C until the dissolution is complete, cooled to room temperature, and stirred evenly and filtered.

[0042] 3. Preparat...

Example Embodiment

[0046] Example 3:

[0047] 1. Formula of epoxy resin composition for high heat resistance aluminum substrate

[0048] Weigh the components as follows: 60 parts of bisphenol A novolac epoxy resin, 22 parts of phenolic resin KPH-L2002 (purchased from Kolon Chemical), and 19 parts of diluent acetone. The hydrolyzed chlorine content of the bisphenol A novolac epoxy resin (NPPN-438) is less than 300 ppm, and the epoxy value is 4.7-5.3 eq / kg.

[0049] 2. Preparation process of epoxy resin composition for high heat resistance aluminum substrate

[0050] The preparation process of the epoxy resin composition for high heat resistance aluminum substrates of the present invention includes the following steps:

[0051] S1. Weigh each component of the formula;

[0052] S2. The phenolic epoxy resin and the phenolic resin are added to the diluent, heated and stirred at 50°C until the dissolution is complete, cooled to room temperature, and stirred evenly and filtered.

[0053] 3. Preparation process of...

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PUM

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Abstract

The invention discloses an epoxy resin composition for a high heat-resisting aluminum substrate as well as a preparation method and application of the epoxy resin composition. The epoxy resin composition for the high heat-resisting aluminum substrate is prepared from the following raw material components in parts by weight: 55 to 65 parts of phenolicepoxy resin, 20 to 24 parts of phenolic resin and 17 to 21 parts of a diluent. An LED (Light-Emitting Diode) aluminum substrate circuit board prepared by the epoxy resin composition for the high heat-resisting aluminum substrate has the advantagesof higher heat resistance, and the capabilities of meeting the requirement of welding processing on heat resistance and ensuring the reliability of welding.

Description

technical field [0001] The invention relates to an epoxy resin composition for an aluminum substrate, in particular to a preparation method of an epoxy resin composition for a high heat-resistant aluminum substrate and an LED aluminum substrate circuit board. Background technique [0002] Generally, the material of the circuit board is glass fiber, but because the LED generates a lot of heat, the circuit board used in the LED lamp is generally an aluminum substrate, which can conduct heat quickly. [0003] The aluminum substrate generally adopts bisphenol A type epoxy resin to react with a curing agent, and the heat resistance of the prepared aluminum substrate is not very good. For circuit board processing and soldering assembly, lead-free soldering of circuit boards will become a foregone conclusion. The melting point of solder is higher than that of lead-containing solder. In order to ensure the reliability of soldering, the materials to be soldered must have higher heat ...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L61/06C08K5/3445H05K1/03
Inventor 肖必华李培德
Owner 纽宝力精化(广州)有限公司
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