Lamination package structure having pin side wall tin climbing function and manufacturing process thereof

Abstract

The invention relates to a lamination package structure having a pin side wall tin climbing function and a manufacturing process thereof. The structure comprises a first paddle and a first pin, wherein the first pin comprises a planar part and a side wall part, the side wall part comprises a plurality of side wall surfaces, the planar part and the side wall part are in transition connection by anarc part, a first chip is arranged on a front surface of the first paddle, a first plastic sealing material wraps peripheral regions of the first paddle, the first pin and the first chip, a second paddle and a second pin are arranged on a surface of the first plastic sealing material, a second chip is arranged on a front surface of the second paddle, and a second plastic sealing material wraps peripheral regions of the second paddle, the second pin and the second chip. Welding tin can climb to a relatively high height along a vertical side wall during welding of a PCB, so that the bonding areaof the welding tin and the pins is expanded; and meanwhile, air at the pins can be discharged along protruding arcs, so that the welding performance and the welding reliability of a product are improved.

Description

technical field [0001] The invention relates to a stacked packaging structure with the function of tin climbing on the side wall of pins and a manufacturing process thereof, belonging to the technical field of semiconductor packaging. Background technique [0002] With the development of modern technology, semiconductor packaging has been widely used. Its extensive applications in radar, remote control telemetry, aerospace, etc. put forward higher and higher requirements for its reliability. The failure caused by poor soldering of semiconductors has attracted more and more attention, because this failure is often fatal and irreversible. Therefore, it is very important to get a good soldering reliability in the semiconductor industry. The tin layer on the soldering surface of the semiconductor can make the soldering stronger, especially for automotive electronics. [0003] As we all know, QFN (Quad Flat No-lead Package, four-sided leadless flat package) and DFN (DuadFlat No...

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Problems solved by technology

[0009] However, this kind of packaging structure that forms L-shaped outer leads or C-shaped outer leads by cutting ribs also has the following defects when forming L-shaped outer leads or C-shaped outer leads: first, when performing outer When the pins are formed, the outer pins are bent toward the side of the plastic package, Figure 1G and Figure 1H The inner pin at A will be affected by the rebound force of the metal, which will cause the metal pin to have the stress of being pulled away from the plastic package downwards, and in the case of this downward force, it is easy to cause A. Delamination occurs between the upper surface of the inner pin and the lower surface of the molding compound

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