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Preparation method of press-molded board

A molding and hot molding technology, applied in the coating and other directions, can solve the problems of poor molding performance, poor product quality stability, uneven product, etc., and achieve the effect of good thickness uniformity, convenient and easy acquisition, and excellent temperature and humidity resistance.

Inactive Publication Date: 2018-06-29
HUIZHOU ZONGSHENG ELECTRONICS MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The laminated insulating boards currently on the market are not only poor in forming performance, but also take a long time to form. During the processing and preparation, the board will rebound after shaping, resulting in uneven products and poor quality stability. Meet performance requirements such as dimensional stability after shaping

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0031] The invention provides a method for preparing a molded plate, comprising the steps of:

[0032] (1) Preparation of resin glue in the preparation method of molded plate:

[0033] Mix 1-10 parts by weight of curing agent with 10-50 parts by weight of organic solvent, and stir at a speed of 800-1000 rpm for 0.5-1.0 hours to obtain a mixed solution A;

[0034] Mix 200-250 parts by weight of resin with 10-50 parts by weight of organic solvent, and stir at a speed of 800-1000 rpm for 0.5-1.0 hours to obtain a mixed solution B;

[0035] Mix the mixed solution A with the mixed solution B, and stir at a speed of 1000-1200rpm for 0.5-1.0 hours to obtain the resin glue;

[0036] Described resin is one or more mixtures in unsaturated polyester resin, polyurethane resin, polypropylene resin.

[0037] The curing agent is one or more of peroxide curing agents or other compound materials, the peroxide curing agent, for example, methyl ethyl ketone peroxide, and the organic solvent is...

Embodiment 1

[0055] 5 parts by weight of methyl ethyl ketone peroxide were mixed with 30 parts by weight of styrene, and stirred at a speed of 800rpm until dissolved, and the stirring time was 0.5 hour to obtain mixed solution A;

[0056] Mix 50 parts by weight of unsaturated polyester resin, 50 parts by weight of polyurethane resin, 100 parts by weight of polypropylene resin and 30 parts by weight of styrene, and stir evenly to the solution at a speed of 800rpm, and the stirring time is 0.5 hours , to obtain the mixed solution B;

[0057] The mixed solution A is mixed with the mixed solution B, and stirred evenly for 0.5 hour at the speed of 1000rpm to obtain the resin glue.

[0058] The above-mentioned resin glue solution is coated on both sides of the glass fiber cloth by a horizontal coating machine with a coating speed of 5m / min, and the glass fiber cloth is a continuous glass fiber cloth to obtain the prepreg.

[0059] Attach release paper on both sides of the prepreg, and leave it ...

Embodiment 2

[0063] The benzoyl peroxide of 5 parts by weight is mixed with the styrene of 30 parts by weight, and is evenly stirred to dissolve under the rotating speed of 800rpm, and stirring time is 0.5 hour, obtains mixed solution A;

[0064] Mix 50 parts by weight of unsaturated polyester resin, 50 parts by weight of polyurethane resin, 100 parts by weight of polypropylene resin and 30 parts by weight of styrene, and stir evenly to the solution at a speed of 800rpm, and the stirring time is 0.5 hours , to obtain the mixed solution B;

[0065] The mixed solution A is mixed with the mixed solution B, and stirred evenly for 0.5 hour at the speed of 1000rpm to obtain the resin glue.

[0066] The above-mentioned resin glue solution is coated on both sides of the glass fiber cloth by a horizontal coating machine with a coating speed of 5m / min, and the glass fiber cloth is a continuous glass fiber cloth to obtain the prepreg.

[0067] Attach release paper on both sides of the prepreg, and l...

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Abstract

The invention relates to a preparation method of a press-molded board, which includes the following steps: 1) mixing 1-10 parts by weight of a curing agent and 10-50 parts by weight of an organic solution, and stirring the mixture to prepare a mixed liquid A; 2) mixing 200-250 parts by weight of resin with 10-50 parts by weight of the organic solution and stirring the mixture to prepare a mixed liquid B, wherein the resin is one or a mixture including more than one of unsaturated polyester resin, polyurethane resin and polypropylene resin; 3) mixing the mixed liquid A with the mixed liquid B and stirring the mixture to prepare resin gum liquid; 4) impregnating a reinforcing material in the resin gum liquid to prepare a prepreg which is a semi-cured sheet; 5) placing at least one layer of the prepreg, in a stacking manner, in a mold of a thermal molding machine, and performing hot-pressing to prepare the press-molded board. The press-molded board has good size stability, is free of rebounding during shaping, has high strength, is good in temperature and humidity resistance, and has excellent anti-impact property; in addition, the press-molded board is environment-friendly and satisfies ROHS and halogen-free demands.

Description

technical field [0001] The invention relates to a method for preparing a molded plate. Background technique [0002] With the rapid development of electronic products and individualized requirements, the performance requirements for materials such as back covers, protective sleeves, and support plates have also increased. Strong insulating boards are used to meet the requirements for the preparation of such products. The laminated insulating boards currently on the market are not only poor in forming performance, but also take a long time to form. During the processing and preparation, the board will rebound after shaping, resulting in uneven products and poor quality stability. It meets performance requirements such as dimensional stability after shaping. Contents of the invention [0003] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a method for preparing a molded board. The molded board prepared by the method for pr...

Claims

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Application Information

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IPC IPC(8): B29C70/42B29B7/00B29B15/10
CPCB29B7/002B29B15/10B29C70/42
Inventor 张宗权
Owner HUIZHOU ZONGSHENG ELECTRONICS MATERIAL CO LTD
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