Integrated circuit analysis system and method with partially evacuated volume for electron beam manipulation

Abstract

The present invention provides new techniques for failure analysis in IC semiconductor devices, including methods for conducting electrical stimulation while a device under test (DUT) is being electrically stimulated or while the device is on its own or mounted in a circuit board or other module System design and methodology for implementing circuit probing using electron beam technology within an IC device under test (DUT) while simultaneously performing activities within a host system. The DUT may be a packaged IC or an IC in some unpackaged form. To create a localized evacuated volume immediately outside the electron beam tool, a sealing element is sealed against or around the DUT to obtain a localized seal. Such an arrangement eliminates the need for vacuum feedthroughs to the potentially thousands of signals required to operate and monitor the DUT, and further enables the DUT to be placed in its normal environment (such as mounted on a circuit board in its system) or The DUT is probed while operating on an error-free tester.

Description

technical field [0001] The present invention relates to integrated circuit (IC) diagnostics, characterization and modification using charged particle beams. Background technique [0002] Electrical fault analysis finds electrical problems throughout the IC device under test (DUT). Node reduction, new materials and more complex structures are driving new fault-finding techniques and improvements in system solutions for detecting faults. [0003] E-beam diagnostic systems are powerful tools for IC characterization and debug applications. For example, electron beam diagnostic systems are used for secondary electron imaging, circuit navigation using built-in computer automation design (CAD) displays, and voltage measurements from active circuits using voltage contrast principles. (See, eg, US Patent No. 4,706,019.) Other electron beam diagnostic systems use electrons in the beam to affect the signal used to detect faults. Such systems include Electron Beam Induced Current (EB...

AI Technical Summary

Problems solved by technology

Previous e-beam solutions all relied on "passing" electrical signals into the SEM's vacuum chamber, a cumbersome and slow process that may require the production of specialized connection devices for specific ICs

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