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Stacked Electronic Components

A technology for electronic components and components, applied in the field of laminated electronic components, can solve problems such as cracks, and achieve the effect of excellent bending strength

Active Publication Date: 2019-11-22
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, when glass is used for the insulating layer, there is a problem that cracks may occur if a very strong bend is applied to the chip

Method used

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  • Stacked Electronic Components
  • Stacked Electronic Components
  • Stacked Electronic Components

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Experimental program
Comparison scheme
Effect test

Embodiment

[0132] The present invention will be further described based on detailed examples below, but the present invention is not limited to these examples.

[0133] First, BaTiO, which is the main component of the dielectric material, is prepared separately 3 Powder: 100 parts by mass; SiO as a subcomponent 2 : 0.5 parts by mass; Y 2 o 3 : 0.8 parts by mass; MgO: 0.5 parts by mass; MnO: 1.0 parts by mass.

[0134] Next, use a ball mill to grind the above prepared BaTiO 3 100 parts by mass of powder and raw materials of subcomponents were subjected to wet pulverization for 15 hours, and dried to obtain raw materials of dielectric materials (dielectric raw materials).

[0135]Then, 100 parts by mass of the obtained dielectric raw material, 10 parts by mass of polyvinyl butyral resin, 5 parts by mass of dioctyl phthalate (DOP) as a plasticizer, and 100 parts by mass of ethanol as a solvent were mixed with a ball mill. The mass parts were mixed and made into a paste to prepare a pas...

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Abstract

The present invention relates to a multilayer electronic component which includes an element body where a plurality of internal electrode layers and dielectric layers are alternately laminated. Insulating layers are disposed on at least one side surface of the element body. The insulating layers contain a glass composition and a ceramic composition. The internal electrode layers contain a metal M and the ceramic composition contains an oxide of the metal M.

Description

technical field [0001] The present invention relates to a laminated electronic component. Background technique [0002] In recent years, with the increase in the density of electronic circuits used in digital electronic devices such as mobile phones, there has been an increasing demand for miniaturization of electronic components, and the miniaturization and increase in capacity of the laminated electronic components constituting the circuits are rapidly progressing . [0003] For example, in multilayer electronic components such as multilayer ceramic capacitors, a plurality of internal electrodes are arranged in a ceramic sintered body. [0004] Patent Document 1 proposes a multilayer ceramic capacitor having a structure in which side gaps are removed in order to improve the use efficiency of electrode materials and increase capacitance and accuracy. [0005] Patent Document 2 proposes a structure capable of improving withstand voltage. That is, after obtaining the ceram...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G4/12H01G4/30
CPCH01G4/1254H01G4/30H01G4/008H01G4/0085H01G4/105H01G4/12H01G4/224H01G4/232H01G4/012H01G4/10H01G4/242
Inventor 野田洋平田中博文
Owner TDK CORPARATION