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Easy-plug server cabinet with liquid cooling heat radiation

A server cabinet, liquid cooling and heat dissipation technology, applied in the direction of cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc. Circulation block air cooling and other issues to achieve energy saving and good heat dissipation effect, easy assembly and disassembly, and reduced space

Pending Publication Date: 2018-06-29
SOUTH CHINA UNIV OF TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There is no clear air channel and intelligent control system in this invention, and at the same time, it cannot be uniformly processed for most liquid cooling solutions
[0007] Patent 201410357779.2 proposes a liquid-cooled and heat-dissipating server cabinet, including a casing, a server board, a heat sink, a heat pipe, a heat pipe, a heat exchanger, and a micro-liquid pump. Each of the server boards is installed with a corresponding The heat dissipation plate described above, the heat dissipation pipe is installed on the heat dissipation plate, the liquid pump and the heat exchanger are connected through the heat dissipation pipe, the heat exchange liquid flows in the heat dissipation pipe and the heat dissipation pipe, and the cabinet is only For cabinets that use similar water-cooled panels, it is not possible to use external circulation block air cooling, and there is no intelligent control system for single cabinets

Method used

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  • Easy-plug server cabinet with liquid cooling heat radiation
  • Easy-plug server cabinet with liquid cooling heat radiation
  • Easy-plug server cabinet with liquid cooling heat radiation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] Such as Figure 1 to Figure 6As shown in the figure, an easily pluggable server cabinet adopting liquid cooling and heat dissipation includes an outer cabinet 1 and an inner cabinet 6, the inner cabinet 6 is located inside the outer cabinet 1, and several servers are arranged in the inner cabinet 6 2. Each server 2 is provided with a liquid cooling device 201, and each liquid cooling device 201 is respectively provided with a liquid inlet and a liquid outlet. The inner cabinet 6 is provided with an integrated heat dissipation door 55. The integrated The heat dissipation door 55 includes the heat dissipation door body and the fan wall 5 arranged on the integrated heat dissipation door 55, the main liquid supply pipeline 7 and the main liquid return pipeline 8, and the liquid inlets of all servers 2 are respectively connected to the liquid inlet quick connectors 202, and connected to the main liquid supply pipeline 7 through the liquid inlet quick connector 202, and the l...

Embodiment 2

[0063] The main structure of this embodiment is the same as that of Embodiment 1, and the similarities will not be repeated here. The difference is that: Figure 7 to Figure 9 As shown, the top of the inner cabinet 6 is provided with a baffle, and the fan 3 and the water-cooled heat exchanger 4 are arranged on the side of the inner cabinet 6 . The air-cooling passage is through the inner cabinet 6 through the fan wall 5, and the inner cabinet 6 and the outer cabinet 1 are located on the side of the liquid pipeline and the main liquid return pipeline 8, and the air flows to the inner cabinet 6 along the air-cooling passage. The two sides flow, and then flow from both sides of the inner cabinet 6 to the fan wall 5 and then enter the interior of the inner cabinet 6 . The difference from Embodiment 1 is that the position of the hot air channel of the air-cooling channel is not the upper part of the inner cabinet 6, but the side area 114 of the inner cabinet, and the top baffle 15 ...

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PUM

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Abstract

The invention relates to an easy-plug server cabinet with liquid cooling heat radiation. The easy-plug server cabinet comprises an outer-layer cabinet and an inner-layer cabinet, wherein the inner-layer cabinet is positioned inside the outer-layer cabinet; a plurality of servers are arranged inside the inner-layer cabinet; a liquid cooling heat radiation device is arranged in each server; a liquidinlet and a liquid outlet are respectively formed in each liquid cooling heat radiation device; the inner-layer cabinet is provided with an integral heat radiation door; the integral heat radiation door comprises a heat radiation door body, a fan wall which is arranged on the integral heat radiation door, a main liquid supply pipeline and a main liquid return pipeline; liquid inlets of all servers are respectively connected with rapid liquid inlet connectors and are connected with the main liquid supply pipeline through the rapid liquid inlet connectors; and liquid outlets of all servers arerespectively connected with rapid liquid outlet connectors and are connected with the main liquid return pipeline through the rapid liquid outlet connectors. Due to design of the integral heat radiation door, the internal structure of a product can be relatively simplified, the cabinet is reasonable in layout, relatively high in integration degree, convenient to assemble and disassemble and convenient to maintain, and components and elements can be conveniently replaced.

Description

technical field [0001] The invention relates to the field of server heat dissipation, in particular to an easily pluggable server cabinet adopting liquid cooling for heat dissipation. Background technique [0002] With the increasing integration of semiconductors and the increasing performance of chips, heat dissipation has become a new bottleneck for electronic equipment. Especially for the data center, the so-called data center refers to the place where computer equipment, server equipment, network equipment, storage equipment and other equipment are stored. Its function is to realize the centralized processing, storage, transmission, exchange and management of information. The energy consumption is huge, and nearly half of the energy consumption of the current data center is heat dissipation. Therefore, realizing energy saving and reducing consumption is one of the problems faced by the data center. [0003] In addition, traditional data centers mostly use precision air-...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20736H05K7/20772H05K7/20781H05K7/20836Y02D10/00
Inventor 李勇刘嵩周文杰黄光文何柏林陈创新陈韩荫
Owner SOUTH CHINA UNIV OF TECH