Phase change heat dissipation structure and manufacturing method thereof

Abstract

The invention discloses a phase change heat dissipation structure and a manufacturing method thereof. The phase change heat dissipation structure includes aluminium foil. The top side of the aluminiumfoil is coated in a flame-retardant heat conduction silica gel layer, and the bottom side of the aluminium foil is coated in a phase change material layer. The flame-retardant heat conduction silicagel layer is prepared by the following raw materials by weight: 2-8 parts of methyl vinyl silicone rubber, 15-20 parts of vinyl silica gel, 18-25 parts of dimethicone, 0.5-2 parts of hydrogen-containing silicone oil, 0.5-1 parts of platinum catalyst, 20-40 parts of aluminium hydroxide, 20-40 parts of magnesium hydroxide, 10-20 parts of nano silicon dioxide, and 10-20 parts of hollow glass bead. The phase change heat dissipation structure has the characteristics of exhibiting good thermal conductivity and good flame resistance and being flexible and compressible, and also has the phase change energy storage characteristic.

Description

technical field [0001] The invention relates to a heat dissipation structure, in particular to a phase change heat dissipation structure and a manufacturing method thereof. Background technique [0002] The heat sink is a device for cooling the heat-prone electronic components in electrical appliances. It is mostly made of aluminum alloy, brass or bronze into plates, sheets, and multi-sheets. For example, the CPU central processing unit in a computer needs to use a large Heat sinks, power tubes in TVs, line tubes, and power amplifier tubes in power amplifiers all use heat sinks. Generally, the heat sink should be coated with a layer of heat-conducting silicone grease on the contact surface between the electronic components and the heat sink during use, so that the heat emitted by the components can be more effectively transferred to the heat sink, and then dissipated into the surrounding air through the heat sink. [0003] In the prior art, metal heat sinks are mostly used....

AI Technical Summary

Problems solved by technology

[0003] In the prior art, metal heat sinks are mostly used. Although metal heat sinks have high thermal conductivity, their interface properties are very poor. Affect heat dissipation