Use of a photosensitive resin composition as LED curable OCA
A technology of photosensitive resin and composition, applied in epoxy resin glue, non-polymer organic compound adhesive, adhesive type and other directions, can solve the problems of large volume shrinkage and so on
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[0060] The present invention will be further described in detail in conjunction with the following examples, but it should not be construed as limiting the protection scope of the present invention.
[0061] 1. Preparation of LED curable OCA
[0062] With reference to the formula shown in Examples 1-8 in Table 1, the raw materials can be mixed evenly. Unless otherwise stated, parts are parts by mass.
[0063] Table 1
[0064]
[0065]
[0066] The meaning of each component code in Table 1 is as follows.
[0067] A-1:
[0068] A-2:
[0069] B-1: Aliphatic polyurethane acrylate (6112-100, Changxing Chemical);
[0070] B-2: polybutadiene acrylate (CN301, Sartomer Chemical);
[0071] B-3: bisphenol A epoxy resin (E-51, Star New Materials);
[0072] B-4:
[0073] C-1: Propylene glycol diacrylate (EM223, Changxing Chemical);
[0074] C-2: Aliphatic epoxy resin (TTA21, Tetel);
[0075] D-1: 1-hydroxy-cyclohexyl-benzophenone (photoinitiator 184);
[0076] D-2: 4...
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