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A kind of high-performance cu-ni-si alloy lead frame material and preparation method thereof

A cu-ni-si, lead frame technology, which is applied to the Cu-Ni-Si alloy lead frame material with high Ni, Si content and its preparation field, can solve the problem of the electrical conductivity and tensile strength of the Cu-Ni-Si alloy. At the same time, taking into account other issues, to achieve the effects of excellent tensile properties and electrical conductivity, improved comprehensive performance, and increased quenching rate

Inactive Publication Date: 2019-09-06
HENAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In order to solve the technical problem that the electrical conductivity and tensile strength of the Cu-Ni-Si alloy in the prior art cannot be taken into account at the same time
Considering the limited solid solubility of Si in the Cu matrix, the strength of the alloy cannot be further improved only through the precipitation phase precipitated during aging

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  • A kind of high-performance cu-ni-si alloy lead frame material and preparation method thereof

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preparation example Construction

[0025] A preparation method of a high-performance Cu-Ni-Si alloy lead frame material, comprising the following steps:

[0026] (1) Melting: first weigh silicon, nickel and copper ingots that meet the ratio, clean the surface to remove oxides, then weigh appropriate amount of silver powder and phosphorus powder, and immediately put them into the vacuum non-consumable electrode arc melting furnace Smelting and vacuuming to a pressure of 5×10 - 2 Pa, then fill the furnace with argon until the pressure in the furnace is 45kPa, then control the temperature in the furnace to rise to 1220-1290°C for smelting to obtain a liquid alloy for later use;

[0027] (2) Casting mold: Preheat the ingot mold placed in the ultrasonic field with a power frequency of 40-120KHz to 195-205°C, and fumigate the inner surface of the ingot mold with benzene, and then, the liquid obtained in step (1) The alloy is cast in the ingot mould, the casting temperature is controlled at 1100-1250°C, and the ingo...

Embodiment 1

[0033] A high-performance Cu-Ni-Si alloy lead frame material is composed of the following components in weight percentage, 1.0% silicon, 4.0% nickel, 0.1% silver, 0.05% phosphorus, and the balance is copper and unavoidable impurity elements.

[0034] The preparation method of the high-performance Cu-Ni-Si alloy lead frame material comprises the following steps:

[0035] (1) Smelting: First weigh 1.0% silicon, 4.0% nickel, and 94.85% copper ingots by weight, clean the surface to remove oxides, then weigh 0.1% silver powder and 0.05% phosphorous powder, Immediately put it into a vacuum non-consumable electrode arc melting furnace for melting, and evacuate to a pressure of 5×10 -2 Pa, then fill the furnace with argon until the pressure in the furnace is 45kPa, after that, control the temperature in the furnace to rise to 1220°C for smelting to obtain a liquid alloy for later use;

[0036] (2) Casting mold: Preheat the ingot mold placed in the ultrasonic field with a power frequ...

Embodiment 2

[0043] A high-performance Cu-Ni-Si alloy lead frame material is composed of the following components in weight percentage, 1.0% silicon, 5.0% nickel, 0.2% silver, 0.06% phosphorus, and the balance is copper and unavoidable impurity elements.

[0044] The preparation method of the high-performance Cu-Ni-Si alloy lead frame material comprises the following steps:

[0045] (1) Smelting: First weigh 1.0% silicon, 5.0% nickel, and 93.74% copper ingots by weight, clean the surface to remove oxides, then weigh 0.2% silver powder and 0.06% phosphorus powder, Immediately put it into a vacuum non-consumable electrode arc melting furnace for melting, and evacuate to a pressure of 5×10 -2 Pa, then fill the furnace with argon until the pressure in the furnace is 45kPa, after that, control the temperature in the furnace to rise to 1230°C for smelting to obtain a liquid alloy for later use;

[0046] (2) Casting mold: Preheat the ingot mold placed in the ultrasonic field with a power freque...

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Abstract

A high-performance Cu-Ni-Si alloy lead frame material comprises, by weight percentage, 4.0-9.0% of nickel, 1.0-1.5% of silicon, 0.1-0.4% of silver, 0.05-0.10% of phosphorus and the balance copper andinevitable impurity elements. A preparation method of the high-performance Cu-Ni-Si alloy lead frame material comprises the steps that the design range of the Ni content and the Si content is enlarged, the number of second phases generated in situ in a solidification process of an alloy is increased, a precipitation phase is precipitated on the dependence of solid-state phase changes in heat treatment to realize strength improvement, a Cu-Ni-Si alloy with the optimal ratio of tensile strength and conductivity is prepared, and the performance requirements of the copper alloy for a large-scale integrated circuit are met.

Description

technical field [0001] The invention relates to the technical field of copper alloy materials, in particular to a Cu-Ni-Si alloy lead frame material with high Ni and Si content and a preparation method thereof. Background technique [0002] With the continuous development of the microelectronics industry, the innovation of smart homes and wearable devices, and the acceleration of high-performance computers, the modern electronics industry not only has high requirements for the circuit optimization and process technology of integrated circuits, but also is indispensable for integrated circuit packaging. Lead frame material, because it undertakes multiple tasks such as fixing chips, information output and circuit heat dissipation. How to effectively improve its strength, thermal conductivity and electrical conductivity has become a research hotspot in the field of copper alloys. At present, there are mainly three types of copper alloys for integrated circuit lead frames devel...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C9/06C22C1/02C22F1/08
Inventor 张毅安俊超高直李丽华万欣娣王智勇劳晓东孙慧丽柴哲宋克兴田保红刘勇国秀花
Owner HENAN UNIV OF SCI & TECH