Three-dimensional outline measuring method based on Structured Illumination Microscopy

A measurement method and three-dimensional contour technology, which is applied in the field of image recognition, can solve problems such as lack of information, distortion of three-dimensional contour edges, and limited application range

Inactive Publication Date: 2018-07-27
SUZHOU INST OF BIOMEDICAL ENG & TECH CHINESE ACADEMY OF SCI
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Problems solved by technology

In reconstructed images obtained by traditional measurement methods, there is often information loss in object edges or mutation areas, resulting in distortion of the obtained 3D contour edges (such as Figure 7 (a), the edge is uneven), and the real contour edge (such as Figure 7 As shown in (b), the edge is smooth and flat) does not match, which seriously limits the application range of this technology

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  • Three-dimensional outline measuring method based on Structured Illumination Microscopy
  • Three-dimensional outline measuring method based on Structured Illumination Microscopy
  • Three-dimensional outline measuring method based on Structured Illumination Microscopy

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Embodiment Construction

[0054] Preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0055] In order to achieve the purpose of the present invention, in some embodiments of a three-dimensional profile measurement method based on structured illumination microscopy, a three-dimensional profile measurement method based on structured illumination microscopy specifically includes the following steps:

[0056]Step 1, using the three-dimensional surface shape measurement method to obtain the three-dimensional surface shape distribution point cloud data of the measured object;

[0057] Step 2, using the structured light illumination method to obtain a two-dimensional plane image of the measured object;

[0058] Step 3, performing image processing on the two-dimensional planar image obtained in step 2 to obtain the super-resolution edge profile of the measured object;

[0059] In step four, the 3D surface distribution point cloud dat...

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Abstract

The invention discloses a three-dimensional outline measuring method based on Structured Illumination Microscopy SIM. The method specifically comprises the following steps: I, acquiring three-dimensional profile distribution spot cloud data of a measured object according to a three-dimensional profile measuring method; II, acquiring a two-dimensional planar image of the measured object according to a structured illumination method; III, performing edge extraction processing on the two-dimensional planar image obtained in the step II, so as to obtain a super-resolution edge outline of the measured object; IV, fusing the three-dimensional profile distribution spot cloud data obtained in the step I with the edge outline obtained in the step III, thereby obtaining three-dimensional profile spot cloud images with accurate edge outlines. According to the method, a three-dimensional profile measurement method is combined with an SIM technique, three-dimensional edge information of the measured object can be accurately obtained, and defects of a conventional 3D profile measurement technique can be effectively overcome.

Description

technical field [0001] The invention belongs to the technical field of image recognition, and in particular relates to a three-dimensional profile measurement method based on structured illumination microscopic technology. Background technique [0002] With the rapid development of computer technology and computer graphics, optical non-contact 3D profilometry methods have been deeply studied and widely used. Three-dimensional surface shape measurement (that is, three-dimensional object surface profile measurement) is an important means to obtain the morphological characteristics of objects, and it is also the basis for recording, comparing and replicating the morphological characteristics of objects. Three-dimensional surface measurement technology has great significance and broad application prospects in the fields of machine vision, automatic processing, industrial inspection, product quality control, physical profiling, biology and medicine. [0003] The basic methods of...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/24G01B11/25
Inventor 文刚梁永李思黾王林波金鑫李辉
Owner SUZHOU INST OF BIOMEDICAL ENG & TECH CHINESE ACADEMY OF SCI
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