A Gaas-based algainp single-sided double-electrode high brightness quaternary light-emitting diode filament and preparation method thereof
A light-emitting diode and filament technology, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problem of material cost, labor cost, production efficiency, and yield constraints of LED filament lamps, and no bright light-emitting diode LED filament and preparation process, It is difficult to meet the technical requirements of the LED filament manufacturing process, etc., to achieve the effects of increased production efficiency, reduced costs, and reduced packaging production costs
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Embodiment 1
[0048] A method for manufacturing a filament of a GaAs-based AlGaInP quaternary light-emitting diode, based on a chip process, including cutting the chip in half one by one after the epitaxial growth and electrode manufacturing steps of the LED chip are completed, and then splitting according to a fixed period, including Proceed as follows:
[0049] (1) GaAs layer 116, DBR layer (Bragg reflection layer) 115, N-type AlGaInP layer 114, quantum well active region 113, P-type AlGaInP layer 112 and GaP layer 111 are sequentially prepared on GaAs substrate 117 by MOCVD process. A P electrode 110 is fabricated on the GaP layer 111, a mesa 213 is fabricated on the N-type AlGaInP layer 114, an N electrode 118 is fabricated on the mesa, and an LED chip is manufactured. structured as figure 1 As shown; the manufactured LED chip is etched from top to bottom from the GaP layer 112 to the N-type AlGaInP layer 114 along the side of the tube core to make the mesa 213, and the etching depth i...
Embodiment 2
[0067] A method for manufacturing a GaAs-based AlGaInP quaternary light-emitting diode filament, wherein, after the epitaxial growth of the LED chip and the electrode manufacturing steps are completed, the chip is cut in half one by one, and then split according to a fixed period, and other steps are as in the embodiment 1, the difference is:
[0068] In step (1), the LED chip made is etched from top to bottom from the GaP layer 112 to the N-type AlGaInP layer 114 along the tube core side to make a mesa 213, and the etching depth is 50 μm; the DBR layer is 12 N-type Al 0.5 Ga 0.5 As / AlAs system. The quantum well active region is an AlGaInP multi-quantum well active layer with a thickness of 0.4 μm;
[0069] The thickness of the GaAs substrate is 180 μm, the thickness of the GaAs layer 116 is 8 μm, the thickness of the N-type AlGaInP layer 114 is 0.8 μm, the thickness of the P-type AlGaInP layer 112 is 0.8 μm, and the thickness of the GaP layer 111 is 6 μm. GaAs substrates ...
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