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Pattern forming device using photo sintering and pattern forming method using same

A pattern and conductive pattern technology, applied in the field of pattern forming devices, can solve problems such as difficult application, poor productivity or process efficiency, and achieve high-efficiency process and productivity, high-efficiency formation, and the effect of preventing metal oxidation

Active Publication Date: 2018-07-31
KOREA INST OF MACHINERY & MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This process is difficult to apply to substrates with relatively large dimensions, and the productivity or process efficiency is relatively poor

Method used

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  • Pattern forming device using photo sintering and pattern forming method using same
  • Pattern forming device using photo sintering and pattern forming method using same
  • Pattern forming device using photo sintering and pattern forming method using same

Examples

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Embodiment Construction

[0057] The invention will be described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the invention are shown. However, this invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity. It should be understood that although the terms first, second, third etc. may be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not are limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another region, layer or section. Thus, a first element, co...

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PUM

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Abstract

Provided are a pattern forming device using photo sintering and a pattern forming method using the same, the device comprising a supply roll, an application device, a mask, a light generating device,and a collection roll. The supply roll supplies a flexible substrate. The application device applies conductive ink onto the substrate. The mask is positioned at an upper part of the substrate to which the conductive ink is applied such that a pattern is formed thereon. The light generating device emits light at the conductive ink applied to the substrate at an upper part of the mask so as to forma conductive pattern on the substrate. The collection roll collects the substrate having the conductive pattern formed thereon.

Description

technical field [0001] The present invention relates to a pattern forming device using intense pulsed light sintering and a method of pattern forming using the pattern forming device, in particular, the present invention relates to a pattern forming device formed on a flexible substrate by intense pulsed light sintering Pattern coated with ink, and a method of pattern formation using the pattern forming device. Background technique [0002] Traditionally, in printed electronics, conductive inks are often used, in which metal powders such as gold, silver and copper are mixed with a solution. Metals are highly conductive and mechanically flexible to facilitate their use on flexible substrates. [0003] During patterning using conductive ink, thermal sintering is generally used, and during thermal sintering, the conductive ink is heated and cooled at a temperature between about 200°C and about 300°C to sinter the metal powder. [0004] However, thermal sintering is a relative...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/12H01L51/00H01L21/56H05K3/38B08B7/02H01L21/033H01L21/02H10K99/00
CPCB08B7/02H01L21/033H01L21/02H01L21/56H05K3/12H05K3/38H10K99/00
Inventor 禹奎照李泽旻权信金仁英崔荣满姜东佑金广泳
Owner KOREA INST OF MACHINERY & MATERIALS
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