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Seal ring, package for housing electronic components, electronic device, and manufacturing method thereof

A technology of electronic components and manufacturing methods, applied in the field of sealing rings, capable of solving problems such as poor airtightness

Active Publication Date: 2021-12-24
KYOCERA CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Figure 5 (a) and Figure 5 The stains shown in (b) correspond to pores in the metal layer 48, and there is a big problem of deteriorating the airtightness between the seal ring and the cover body 49.

Method used

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  • Seal ring, package for housing electronic components, electronic device, and manufacturing method thereof
  • Seal ring, package for housing electronic components, electronic device, and manufacturing method thereof
  • Seal ring, package for housing electronic components, electronic device, and manufacturing method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0083] Plates made of Kovar alloy (containing 0.09% silicon oxide in the alloy, 0.01% aluminum oxide in the aluminum content, 0.34% manganese sulfide iron-29 mass % nickel- 17 mass % cobalt, width 20 mm, length 100 m) of the base material 12 is nickel-plated on the first surface and the second surface to provide the nickel layer 14 respectively. Next, as metal solder, a plate (width 20 mm, length 100 m) made of silver-28% by mass copper alloy is pressure-bonded on the second surface to set the metal solder layer 16, and it is fired at 600° C. for 3 minutes and at a reduction rate of 60 % is rolled to produce a sealing ring.

[0084] The seal ring 1 is produced by punching from the second surface of the metal solder provided with the seal ring. The thickness of each layer of the obtained seal ring 1 is shown in Table 1.

[0085] Nickel electroplating was performed on the nickel layer 14 of the obtained seal ring 1 to have a thickness of 3 μm to provide an upper nickel layer 2...

Embodiment 2

[0088] Example 1 was repeated except that the thickness of each layer was changed as shown in Table 1.

[0089] The results are shown in Table 1.

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Abstract

The object of the present invention is to provide a seal ring that can prevent stains on the surface of the metal plating layer in a seal ring that has a metal solder layer on one side and a metal plating layer on the other side of a base material containing kovar alloy, and realizes housing of electronic components Excellent airtightness of the package. The present invention solves the above problems by an annular seal ring having a nickel layer on the first surface of a base material containing Kovar (iron-nickel-cobalt alloy) and having a second layer on the opposite side of the first surface. There are metal solder layers on both sides, and the thickness of the nickel layer is 0.1 μm to 20 μm.

Description

technical field [0001] The present invention relates to a seal ring, a package for housing electronic components, electronic equipment, and methods for manufacturing them. Background technique [0002] Electronic components such as SAW filters and crystal resonators used in electronic equipment such as mobile phones are used as packages in which such electronic components are accommodated in a case having an opening and sealed with a lid. Hermetic packages are used to prevent electronic components from becoming unstable due to moisture and oxygen in the air. [0003] In the package of the electronic component, the shell is usually made of ceramics such as alumina, aluminum nitride, etc., and the cover is made of Kovar alloy (iron-nickel-cobalt alloy (KOVAR: U.S. registered trademark serial number No. 71367381)), Made of low thermal expansion metals such as iron-nickel alloys. [0004] As a method of joining the cover to the case, there is a method of joining the base mater...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H03H9/02H01L23/02H01L23/10H03H3/02
CPCH03H3/02H01L2924/16195H03H3/08H03H9/1014H03H9/1071H01L23/10H03H9/02
Inventor 竹冈治己吉田一晴井户隆太竹内顺一
Owner KYOCERA CORP
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