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High-heat-conduction polyimide film and preparation method thereof

A technology of polyimide film and polyimide matrix, which is applied in the field of polyimide film and its preparation, and can solve the problem that the film cannot achieve high thermal conductivity, polyimide cannot be formed into a film, and the content of inorganic thermally conductive fillers is low. problem, to achieve the effect of improved bonding force, good coating, and good tear resistance film-forming performance

Active Publication Date: 2018-08-10
株洲时代华鑫新材料技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the content of inorganic thermally conductive filler is too low, the film cannot achieve high thermal conductivity, and if the content of inorganic thermally conductive filler is too high, polyimide cannot be formed into a film

Method used

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  • High-heat-conduction polyimide film and preparation method thereof
  • High-heat-conduction polyimide film and preparation method thereof
  • High-heat-conduction polyimide film and preparation method thereof

Examples

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Embodiment 1

[0032] A polyimide film with high thermal conductivity, comprising a polyimide matrix and α-crystal Al that is uniformly distributed in the polyimide matrix and surface-modified by a coupling agent 2 o 3 Inorganic thermally conductive filler. In this embodiment, the particle sizes of the inorganic thermally conductive fillers are 1 μm, 0.2 μm, and 30 nm respectively (the schematic diagram of the structure is shown in figure 1 Shown in d), and the mass ratio of the three particle sizes is 7:2:1.

[0033] The preparation method of above-mentioned high thermal conductivity polyimide film comprises the following steps:

[0034] (1) Surface modification of inorganic thermally conductive fillers and preparation of composite thermally conductive slurry: Add 50 g of inorganic thermally conductive fillers with three particle sizes of micron, submicron and nanometer into the ethanol / water mixed solution, and then add 1.5 g coupling agent γ-aminopropyltriethoxysilane, ultrasonic and h...

Embodiment 2

[0038] In Example 2, compared with Example 1, only the type of the inorganic heat-conducting filler was changed, and the same method as in Example 1 was used to prepare a polyimide film. See Table 1 for specific differences.

Embodiment 3

[0040] Example 3 Compared with Example 1, only the type of aromatic polyaryl ether diamine was changed, and the same method as Example 1 was used to prepare a polyimide film. See Table 1 for specific differences. In this embodiment, the structural representation of the polybasic aromatic ether diamine is as follows:

[0041]

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Abstract

The invention discloses a high-heat-conduction polyimide film. The high-heat-conduction polyimide film comprises a polyimide matrix and inorganic heat-conducting filler uniformly distributed in the polyimide matrix; the mass of the inorganic heat-conductive filler accounts for 30-60% of the total mass of the high-heat-conduction polyimide film; and the grain sizes of the inorganic heat-conductingfiller comprise three grain sizes of micron-grade grain size, submicron-grade grain size and nano-grade grain size, wherein the mass of micron-grade inorganic heat-conducting filler accounts for 40-90% of the total mass of the inorganic heat-conducting filler, the mass of submicron-grade inorganic heat-conducting filler is not more than 30% of the total mass of the inorganic heat-conducting filler, and the mass of the nano-sized inorganic heat-conductive filler is not more than 30% of the total mass of the inorganic heat-conducting filler. The invention also correspondingly provides a preparation method of the high-heat-conduction polyimide film. The polyimide film provided by the invention has the high comprehensive performance of high heat conductivity, good tear resistance and film forming performance and the like.

Description

technical field [0001] The invention belongs to the field of polymer composite materials, in particular to a polyimide film and a preparation method thereof. Background technique [0002] Polyimide (PI) film is a highly competitive high-temperature insulating material, which has been widely used in flexible printed circuit substrates, microelectronic integrated circuits, battery packaging and special electrical appliances. However, in these fields, microelectronics are in a high-density and high-speed operation state, which makes electronic components and integrated circuits dissipate a lot of heat. Because polyimide itself is almost a poor conductor of heat, the thermal conductivity of traditional polyimide film is about 0.16W / (m K), which has poor thermal conductivity and is easy to accumulate heat, which affects the stability, life and safety of electronic components. It is safe to operate and limits the upgrading of related industries. In order to meet the increasing t...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08K9/06C08K3/22C08K3/38C08J5/18C08G73/10
CPCC08G73/1042C08G73/1064C08G73/1071C08J5/18C08J2379/08C08K9/06C08K2003/2227C08K2003/385C08K2201/003C08K2201/011
Inventor 刘杰江乾王倩廖波刘磊高纪明姜其斌
Owner 株洲时代华鑫新材料技术有限公司
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