A CPU cooling system based on nanofluid
A nanofluid, heat dissipation and cooling technology, which is applied in the direction of instruments, calculations, electrical digital data processing, etc., can solve the problems of heat transfer efficiency limitations, and achieve the effects of avoiding noise, strengthening convective heat transfer, and good cooling effect
Active Publication Date: 2019-02-01
CHINA UNIV OF MINING & TECH
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Problems solved by technology
The invention uses liquid cooling technology to reduce the temperature of the chip to a certain extent, but the heat transfer surfaces of the heat absorbing part and the heat sink part are smooth planes, which limits the heat transfer efficiency
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[0029] The present invention will be further described below.
[0030] As shown in the figure, the present invention includes a CPU cooling box, a water tank, a temperature acquisition device, a differential pressure transmitter, a CPU chip temperature measuring device, a low-temperature constant temperature tank, a flow meter and a peristaltic pump. The CPU cooling box is fixed on the CPU bracket 4, The CPU cooling box is made up of a plurality of side plates 9, an acrylic plate 3 and a CPU heat absorbing plate 5, the acrylic plate 3 is arranged in parallel above the CPU heat absorbing plate 5, and the upper and lower ends of the multiple side plates 9 are connected with the acrylic plate 3 respectively. It is sealed and fixed with the CPU heat absorbing plate 5, so that the side plate 9, the acrylic plate 3 and the CPU heat absorbing plate 5 form a cavity 8, and the acrylic plate 3 is provided with a liquid inlet 1 and a liquid outlet 2, which are located in the cavity 8 The...
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The invention discloses a nanofluid-based CPU cooling system. A CPU cooling box consists of multiple side plates, an acrylic plate and a CPU heat absorption plate; the acrylic plate is arranged abovethe CPU heat absorption plate in parallel; the upper and lower ends of the side plates are hermetically fixed with the acrylic plate and the CPU heat absorption plate to define a cavity; a liquid inlet and a liquid outlet are formed in the acrylic plate; multiple semispherical bulges are arranged on one side surface of the CPU heat absorption plate in the cavity; the other side surface of the CPUheat absorption plate is clung to a CPU chip; a liquid inlet of the CPU cooling box is connected with one end of a valve; the other end of the valve is connected with the output end of a peristaltic pump; the input end of the peristaltic pump is connected with the liquid outlet end of a water tank; the liquid inlet end of the water tank is connected with the liquid outlet end of a low-temperaturethermostatic bath; and the liquid inlet end of the low-temperature thermostatic bath is connected with a liquid outlet of the CPU cooling box. Through a nanofluid and the CPU cooling box with the bulges, the heat exchange efficiency of the CPU chip can be improved, so that the temperature of the CPU chip is reduced; and no fan is required, so that noises are avoided.
Description
technical field [0001] The invention relates to a heat radiation cooling system, in particular to a CPU heat radiation cooling system based on nanofluid. Background technique [0002] With the advancement of electronic technology, computer CPU chips are developing in the direction of high density, high power, and high frequency. However, the high calorific value of CPU has become a bottleneck restricting its development. The further high density and high power of CPU chips have greatly increased the heat generation per unit area. In order to make the CPU play its best performance and ensure operational reliability, safety and service life, it is particularly important to adopt effective heat dissipation and cooling methods. Urgent and important. [0003] Currently, there are various ways to dissipate heat from a CPU. Among them, air cooling is the most commonly used heat dissipation method, and is widely used in desktop computers and notebook computers due to its low cost ...
Claims
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IPC IPC(8): G06F1/20
CPCG06F1/20G06F2200/201
Inventor 齐聪赵宁陈田田刘毛妮李春阳
Owner CHINA UNIV OF MINING & TECH