Method for regenerating acidic waste etching solution through synergistic oxidation by using hydrogen peroxide generated through oxygen cathode reduction and chlorine generated through anodic oxidation

An acid etching waste liquid, anodizing technology, applied in the field of PCB acid etching liquid etching process, can solve the problems of poor chemical stability of hydrogen peroxide, weak oxidation ability, slow regeneration rate, etc. The effect of improving stability

Inactive Publication Date: 2018-08-17
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The advantage of oxidizing monovalent copper with oxygen is that the raw material is cheap, but the oxidation ability of oxygen to monovalent copper ions is weak, and the regeneration rate is too slow; the chemical stability of hydrogen peroxide is poor, and it is difficult to preserve

Method used

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  • Method for regenerating acidic waste etching solution through synergistic oxidation by using hydrogen peroxide generated through oxygen cathode reduction and chlorine generated through anodic oxidation

Examples

Experimental program
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Effect test

Embodiment 1

[0032] The method of synergistically oxidizing and regenerating acid etching waste liquid by using hydrogen peroxide generated by oxygen cathode reduction and chlorine generated by anodic oxidation includes the following steps:

[0033] (1) Prepare an acidic etching solution with a total copper concentration of 130g / L (no monovalent copper ions), an acidity value of 1.5N, and a chloride ion concentration of 260g / L for the etching machine;

[0034] (2) The acid etching waste liquid flows out from the etching production line. Due to the reaction during the etching process, the monovalent copper ion concentration in the acid etching waste liquid rises to 1.4g / L and the ORP value drops to 425mv at this time;

[0035] (3) The acid etching waste liquid from the printed circuit board production line is introduced into the electrolytic tank through the etching tank, and the flow rate of the acid etching waste liquid into the electrolytic tank is 3.6m 3 / h, then 1.0m 3 / h gas flow oxygen into ...

Embodiment 2

[0039] The method of synergistically oxidizing and regenerating acid etching waste liquid by using hydrogen peroxide generated by oxygen cathode reduction and chlorine generated by anodic oxidation includes the following steps:

[0040] (1) Prepare an acidic etching solution with a total copper concentration of 150g / L (no monovalent copper ions), an acidity value of 1.6N, and a chloride ion concentration of 260g / L for the work of the etching machine;

[0041] (2) The acid etching waste liquid flows out from the etching production line. Due to the reaction in the etching process, the monovalent copper ion concentration in the acid etching waste liquid rises to 1.2g / L, and the ORP value drops to 430mv;

[0042] (3) The acid etching waste liquid flowing out of the printed circuit board production line is introduced into the electrolytic tank through the etching tank, and the acid etching liquid is 4.0m 3 / h flow from the etching cylinder into the electrolytic cell, and then at 1.6m 3 / h ...

Embodiment 3

[0046] The method of synergistically oxidizing and regenerating acid etching waste liquid by using hydrogen peroxide generated by oxygen cathode reduction and chlorine generated by anodic oxidation includes the following steps:

[0047] (1) Prepare an acidic etching solution with a total copper concentration of 170g / L (no monovalent copper ions), an acidity value of 2.0N, and a chloride ion concentration of 260g / L for use in the etching machine;

[0048] (2) The acid etching waste liquid flows out from the etching production line. Due to the reaction during the etching process, the monovalent copper ion concentration in the acid etching waste liquid rises to 1.6g / L and the ORP value drops to 420mv at this time;

[0049] (3) The acid etching waste liquid flowing out of the printed circuit board production line is introduced into the electrolytic tank through the etching tank, and the acid etching solution is 5.4m 3 / h flow from the etching tank to the electrolytic tank, and then at 1.8...

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Abstract

The invention discloses a method for regenerating an acidic waste etching solution through synergistic oxidation by using hydrogen peroxide generated through oxygen cathode reduction and chlorine generated through anodic oxidation. The method includes the following steps that (1) the acidic waste etching solution flowing out of a printed circuit board production line is guided into an electrolyticbath through an etching bath, oxygen is introduced to the cathode of the electrolytic bath, meanwhile, the electrolytic bath is started, and the acidic waste etching solution is oxidized; and (2) theoxidized acidic waste etching solution is guided into a regulating tank, the acidity value and the total copper ion concentration of the oxidized acidic waste etching solution are regulated to a concentration range suitable for etching work, the oxidized acidic waste etching solution flows back to an etching working area, and the next round of etching is carried out. The method perfectly combinesthe two advantages that the oxygen is easily obtained and the hydrogen peroxide has high oxidizability; and moreover, operation is easy, the components of the etching solution are not changed, the stability of the etching process is improved, and the etching technology is improved.

Description

Technical field [0001] The invention relates to the field of etching process of PCB acid etching solution, in particular to a method for synergistic oxidation and regeneration of acid etching waste liquid by utilizing hydrogen peroxide generated by oxygen cathode reduction and chlorine generated by anodic oxidation. Background technique [0002] Printed circuit board (PCB) is an important part of electronic products. Acid etching has a wide range of applications, among which there are mainly three types of iron trichloride etching solution, sulfuric acid / hydrogen peroxide system etching solution and acid copper chloride etching solution. The acid copper chloride system is currently the most widely used etching solution. In the production process of PCB boards, high-copper etching waste will be produced. If it is directly discharged into the environment without strict treatment, it will not only cause waste and loss of resources, but also cause great harm to humans and the natural...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/46
CPCC23F1/46
Inventor 黄洪吴晓娟司徒粤
Owner SOUTH CHINA UNIV OF TECH
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