Carrier for sheet wafer processing

Abstract

The invention discloses a carrier for sheet wafer processing. The carrier comprises a shell with an upward opening, and adjusting mechanisms used for adjusting the horizontal inclination angle of a product is arranged in the shell; magnetorheological fluid is poured into the shell, so that the adjusting mechanisms are immersed in the magnetorheological fluid, and when the lower part of the productis connected to the adjusting mechanisms, the adjusting mechanisms drive the product to swing to a set position for standing, and a to-be-processed part of the product is located above the magnetorheological fluid level; and a magnetic field generator is arranged on the shell and is used for driving the magnetorheological fluid in the shell to be solidified or reset to be in a fluid state. According to the carrier for sheet wafer processing, the performance requirement of the slide wafer is low, so that the consumable cost is low, meanwhile, the fragment rate of the functional wafer is low onthe basis of firm clamping, and the qualified rate of the whole product is high.

Description

technical field [0001] The invention relates to the technical field of wafer processing, in particular to a carrier for sheet wafer processing. Background technique [0002] Sheet wafers, especially thin wafers with a thickness of less than 1 mm, often need to be temporarily bonded to a carrier wafer during processing, so as to improve the strength of the functional wafer and facilitate processing. For example, thinning and grinding, etching, cutting, etc., and finally the functional wafer is separated from the carrier wafer to complete the processing of the functional wafer. [0003] And in the prior art, in order to facilitate the separation of the functional wafer and the carrier wafer, and also to reduce the processing cost, the above-mentioned carrier wafer is mostly made of engineering plastics, and the carrier wafer made of this engineering plastic The circle is cut synchronously with the cutting process of the functional wafer, so the carrier wafer made of this engi...

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Problems solved by technology

[0003] And in the prior art, in order to facilitate the separation of the functional wafer and the carrier wafer, and also to reduce the processing cost, the above-mentioned carrier wafer is mostly made of engineering plastics, and the carrier wafer made of this engineering plastic The circle is cut synchronously with the cutting process of the functional wafer, so the carrier wafer made of this engineering plastic in the prior art is mostly a disposable consumable

[0004] However, in the prior art, the functional wafer and the temporarily bonded product of the carrier wafer are clamped by the conventional mechanical angle on the processing machine tool, which can easily cause the functional wafer to break, so the processing is difficult.

The selection of engineering plastics with better strength and hardness will lead to an increase in processing costs, which is not conducive to the production and operation of enterprises.

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