Electrostatic atomizing cooling system for high heat flux density surface

Abstract

The invention discloses an electrostatic atomizing cooling system for a high heat flux density surface. The system comprises a pipeline system, an electrostatic atomizing device and a controller, wherein the pipeline system is formed by connecting a liquid storing tank, a circulating pump and a heat exchanger through pipelines; the electrostatic atomizing device is that a micron pore array and a high pressure pore plate are mounted in a nozzle; an atomizing chamber is formed between the micron pore array and a nozzle housing; a flow rate controller and a voltage controller are arranged in thecontroller; the circulating pump is used for pumping cooling liquid from the liquid storing tank, and the cooling liquid injected through the electrostatic atomizing device is collected to a bottom plate below an atomizing system, and the bottom plate is connected to a heat exchanger through a liquid returning pipe and is led to the liquid storing tank; a temperature controller for measuring the temperature of a cooled object is mounted on the bottom plate. According to the system, the rotating speed of a circulating pump is controlled, and the flow rate is changed to adapt to the cooling of the high heat flux density base surface; the voltage and the atomizing flow rate can be accurately adjusted based on the temperature; and moreover, a circulating pipeline system is arranged, so that the problems that the atomizing speed and the atomizing capacity are hard to adjust and the cooling liquid cannot be recycled by an existing atomizing cooling device can be solved.

Description

technical field

[0001] The invention belongs to the field of cooling and heat exchange, and in particular relates to an electrostatic atomization cooling system for surfaces with high heat flux density. Background technique

[0002] With the application of ultra-high power lasers and microwave generators in military, medical, scientific research, aerospace and other fields, the problem of high heat flux and efficient heat dissipation is becoming more and more important. However, at this stage, the traditional single-phase circulating air cooling and circulating liquid cooling technologies based on natural convection and forced convection (the heat dissipation capacity is less than 100W / cm 2 ) has obviously failed to meet the thermal control requirements under high-power extreme conditions. Therefore, in response to high heat flux electronic component cooling technology and special space heat load management requirements, the development of high and ultra-high heat flux equi...

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