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Laser cutting system and cutting method

A technology of laser cutting and cutting method, applied in laser welding equipment, metal processing equipment, welding equipment and other directions, can solve the problem of offset of cutting line, and achieve the effect of improving quality, improving cutting quality and saving cutting time

Inactive Publication Date: 2018-08-31
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention provides a laser cutting system and a cutting method, which are used to solve the problem that the cutting of the display screen requires multiple independent cuttings of different laser sources, and there is an offset between different laser sources and the cutting line.

Method used

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  • Laser cutting system and cutting method
  • Laser cutting system and cutting method

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Embodiment Construction

[0030] In the prior art, different laser sources are required to cut different layer structures in the cutting of display screens, and different laser sources are aligned to the same cutting line through different driving mechanisms for cutting, resulting in alignment offsets of different laser sources, which affect the cutting quality .

[0031] In order to solve the above technical problems, the present invention provides a laser cutting system, which can be used but not limited to cutting display screens. The laser cutting system includes at least two laser sources, the at least two laser sources are used to cut different layer structures of the substrate to be cut, and the lasers emitted by the at least two laser sources cut the to-be-cut substrate along the first cutting line. substrate. Wherein, the positions of the at least two laser sources are relatively fixed, and the laser light emitted by the at least two laser sources is projected onto the substrate to be cut, an...

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PUM

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Abstract

The invention relates to the technical field of display, and discloses a laser cutting system and a cutting method. According to the laser cutting system, the positions of all laser sources of the laser cutting system are relatively fixed, and projected light spots of lasers emitted from different laser sources on the plane of a substrate to be cut do not coincide. A geometric center line of the projected light spots of the lasers emitted from all the laser sources on the substrate to be cut are parallel to a cutting line, and that is, the projected light spots of the lasers emitted from all the laser sources are disposed at a distance from each other along the cutting line, so that all the laser sources can simultaneously cut the substrate to be cut along the same cutting line. Cutting lines cut by different laser sources completely coincide, the offset caused by the situation that different laser sources are aligned to the cutting line through different driving mechanisms for cuttingis avoided, the cutting quality is improved and the quality of a product is improved; and the cutting time is saved, the process is simplified, dust and particles produced by cutting are reduced, andthe heat-affected zone is reduced.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a laser cutting system and a cutting method. Background technique [0002] In the prior art, laser cutting display screens are used, and the existing laser cutting system structure is mainly CO 2 Cutting unit, Femto (femtosecond) laser cutting unit and mobile machine table. A cut line of the display is made of CO 2 Laser and Femto laser cutting are completed once respectively. CO 2 Laser cutting upper protective film, when CO 2 The laser cuts the upper protective film of the entire substrate in one direction, and the machine moves to the Femto laser cutting unit to cut the Panel and the lower protective film. Whether the two cutting paths coincide depends on the CO 2 The degree of deviation between the action point of the laser and Femto laser on the display and the moving direction of the machine. For each cut, the corresponding CO 2 And the Femto laser head needs to mo...

Claims

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Application Information

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IPC IPC(8): B23K26/38B23K26/06B23K26/70
CPCB23K26/38B23K26/0604B23K26/702
Inventor 胡红伟于名印辛燕霞佘建民李千数王神通王旭东徐晶张彩霞
Owner BOE TECH GRP CO LTD
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