Forming method and forming device of a double-layer plate structure
A molding device and molding method technology, applied in the field of parts processing, can solve the problems that the superplastic forming/diffusion bonding process cannot be realized, the temperature difference between superplastic forming and diffusion bonding is large, and the cost is high, so as to achieve shortened processing cycle, low cost, The effect of reducing the cost of production
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Embodiment 1
[0037] Such as Figure 1 to 2 As shown, a method for forming a double-layer board structure includes the following steps:
[0038] X1. Cut the material board into multiple pieces by a shearing machine. Place two cushion blocks 15 on the processing platform 13 with a distance between the two cushion blocks 15. Place the cut material board on the cushion block 15 Fix the edge of the material plate on the spacer block 15 by the fixing clamp 7, and the middle part of the material plate covers the space between the two spacer blocks 15;
[0039] X2, the material plate is connected to the negative electrode of the power supply through the negative lead 11, the processing tool head 1 is connected to the positive electrode of the power supply through the positive lead 10, the processing tool head 1 is in contact with the material plate, and the processing tool head 1, the material plate and the power source form a closed loop;
[0040] X3. The current in the loop generates Joule heat on the...
Embodiment 2
[0050] Such as Figure 1 to 2 As shown, a method for forming a double-layer board structure includes the following steps:
[0051] X1. Cut the material board into multiple pieces by a shearing machine. Place two cushion blocks 15 on the processing platform 13 with a distance between the two cushion blocks 15. Place the cut material board on the cushion block 15 Fix the edge of the material plate on the spacer block 15 by the fixing clamp 7, and the middle part of the material plate covers the space between the two spacer blocks 15;
[0052] X2, the material plate is connected to the negative electrode of the power supply through the negative lead 11, the processing tool head 1 is connected to the positive electrode of the power supply through the positive lead 10, the processing tool head 1 is in contact with the material plate, and the processing tool head 1, the material plate and the power source form a closed loop;
[0053] X3. The current in the loop generates Joule heat on the...
Embodiment 3
[0065] Such as Figure 1 to 2 As shown, a method for forming a double-layer board structure includes the following steps:
[0066] X1. Cut the material board into multiple pieces by a shearing machine. Place two cushion blocks 15 on the processing platform 13 with a distance between the two cushion blocks 15. Place the cut material board on the cushion block 15 Fix the edge of the material plate on the spacer block 15 by the fixing clamp 7, and the middle part of the material plate covers the space between the two spacer blocks 15;
[0067] X2, the material plate is connected to the negative electrode of the power supply through the negative lead 11, the processing tool head 1 is connected to the positive electrode of the power supply through the positive lead 10, the processing tool head 1 is in contact with the material plate, and the processing tool head 1, the material plate and the power source form a closed loop;
[0068] X3. The current in the loop generates Joule heat on the...
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