Manufacturing method of ultrathin heat pipe wick

Abstract

The invention provides a manufacturing method of an ultrathin heat pipe wick. The manufacturing method of the ultrathin heat pipe wick comprises the steps of firstly rolling a metal wire to be straight, placing a transparent mold into a positioning device, then inserting the metal wire into the mold, centering, then filling metal powder into a cavity between the mold and the metal wire, sinteringunder the specified parameters, and taking a sample out. The metal wire has a favorable mechanical property, so that the filiform wick provided by the invention is not easy to break off and can be bent at any angle so as to be suitable for ultrathin heat pipes in various shapes; the length and the diameter of the wick can be changed by a simple step, so that the manufacturing cost is greatly saved; and the filiform wicks are arranged in an ultrathin heat pipe in parallel, so that steam and liquid are separated, the steam-liquid friction resistance is reduced, the steam and the liquid flow favorably, and the reflowing capability of a condensed liquid is improved through a porous medium. The manufacturing method provided by the invention is simple, easy and practicable, simple and cheap in process equipment, and capable of realizing mass production, and has a higher commercial value.

Description

technical field [0001] The invention belongs to the technical field of heat pipe manufacturing, in particular to a method for manufacturing an ultra-thin heat pipe liquid-absorbing core. Background technique [0002] As an efficient passive phase change heat transfer device, the heat pipe itself can be self-driven without external energy. It has the advantages of small size, high stability, low cost, and strong thermal conductivity. It has been widely used in various electronic devices. It is an ideal cooling device to solve the problem of high heat flux density of electronic equipment. Under the market orientation, electronic products are constantly developing towards higher performance and thinner. For example, the thickness of notebook computers or tablets has been reduced to 10mm, the thickness of mobile phones has been reduced to 5mm, and the heat dissipation gap of fuel cells is only 3mm. At present, the commonly used cylindrical heat pipes or flattened heat pipes are...

AI Technical Summary

Problems solved by technology

The groove type liquid absorbent core is mainly prepared by special processing techniques such as chemical and laser etching. The processing technology is complicated and the cost is high, and the groove type liquid absorbent core has small capillary force and is easily affected by gravity; The liquid core is light in weight and low in cost, and is currently the most commonly used liquid core structure for ultra-thin heat pipes. However, the capillary force of the wire mesh liquid core is generally low, the anti-gravity performance is weak, and the heat flux density it can withstand is low; The capillary force of the powder sintered liquid-absorbent core is larger than that of the groove type and the wire mesh type, and it is beneficial to boiling and condensation heat exchange, but the powder sintered liquid-absorbent core is prone to problems such as shedding, cracks, and fractures. The thickness of the powder Restricted by the size of the heat pipe; the composite absorbent core combines the advantages of various types of absorbent cores, and can solve the problems of small capillary force, low permeability and large thermal resistance of the single-structure absorbent core. However, the composite liquid-absorbent core also has the disadvantages of complex manufacturing process and relatively high cost, which is not conducive to commercial production.

In the traditional heat pipe with copper wire as the liquid-absorbing core, the sharp corner area formed between the copper wire and the shell provides the capillary force for the reflux of the condensed liquid. Although the processing is relatively simple, the capillary force provided by the sharp corner area is very limited

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