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High-performance flexible contact force sensor and preparation method thereof

A sensor and high-performance technology, applied in the field of high-performance flexible touch force sensor and its preparation, can solve problems such as poor stability, slow response speed, and limited pressure measurement range, and achieve high stability, high linearity, and strong durability Effect

Inactive Publication Date: 2018-09-21
PEKING UNIV
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AI Technical Summary

Problems solved by technology

Although the flexible touch force sensor prepared by the above method has high sensitivity and simple structure, compared with the silicon-based touch force sensor based on MEMS (micro-electromechanical system) technology, it still has low precision, limited pressure measurement range, poor stability, Disadvantages such as slow response

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  • High-performance flexible contact force sensor and preparation method thereof
  • High-performance flexible contact force sensor and preparation method thereof
  • High-performance flexible contact force sensor and preparation method thereof

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Embodiment Construction

[0043] The high-performance flexible touch force sensor proposed by the present invention and its preparation method are described as follows in conjunction with the accompanying drawings and examples.

[0044] The n×m flexible touch force sensing array that can be realized by the high-performance flexible touch force sensor technology proposed in this embodiment is as follows: figure 1 as shown, figure 1 where n=m=10. Among them, the force sensor is a MEMS silicon-based piezoresistive force sensor 1, two adjacent sensors are connected by a certain thickness of parylene (Parylene) 2, and the surface of the sensor is also conformally deposited with a certain thickness of parylene. Toluene (Parylene)2.

[0045] The structure of the MEMS silicon-based piezoresistive touch sensor 1 is shown in Figure 2(a), in which the freely suspended elastic cantilever beam 3 is connected to the peripheral support frame 4 and the internal suspended silicon block 5, and when pressure is applied...

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Abstract

The invention discloses a high-performance flexible contact force sensor and a preparation method thereof. The high-performance flexible contact force sensor is a high-performance flexible contact force sensing array manufactured based on a process of a flexible micro electro mechanical system, a silicon-based piezoresistive contact force sensor is used as a sensing unit, and a flexible isolationgroove filled with a flexible polymer material is used as flexible interconnection. The contact force sensing array realized through the processing technology of the high-precision silicon-based microelectro mechanical system has high linearity and sensitivity, the structure is stable, the performance is reliable, and the durability is good; meanwhile, the new technology of realizing the flexiblecontact force sensor by connecting the flexible isolation groove with the rigid sensing unit has potential application value.

Description

technical field [0001] The invention relates to the field of micro-nano processing, in particular to a high-performance flexible touch force sensor manufactured by a flexible micro-electromechanical system technology (flexible MEMS technology) based on parylene (Parylene) and a preparation method thereof. Background technique [0002] Flexible touch force sensor is a flexible electronic device used to detect the magnitude of contact force. It is one of the current research hotspots in flexible electronics technology. It has broad applications in the fields of robots, electronic skin, wearable devices, flexible touch screens, and intelligent medical care Application prospect. Especially for the robot industry, whether it is an industrial robot applied in a manufacturing environment or a service robot applied in a non-manufacturing environment, a high-precision and high-reliability touch force sensing system is required. For example, the rapid development of surgical robots i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B82B3/00G01L1/18
CPCB82B3/0004G01L1/18
Inventor 王玮张美璇金玉丰
Owner PEKING UNIV
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