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Preparation method of organic silicon modified epoxy resin

A technology of epoxy resin and organosilicon, which is applied in the field of preparation of organosilicon modified epoxy resin, can solve the problems of poor toughness and poor thermal stability of epoxy resin, so as to increase the glass transition temperature and realize the glass transition temperature , Improve the effect of crosslinking density

Inactive Publication Date: 2018-09-21
SOUTH CHINA UNIV OF TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for the synthesis and preparation of a novel organosilicon-modified epoxy resin, in order to improve the poor thermal stability and poor toughness of the epoxy resin after curing

Method used

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  • Preparation method of organic silicon modified epoxy resin
  • Preparation method of organic silicon modified epoxy resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] According to the proportioning of reactant, the dibutyltin dilaurate of 100g two parts of A-type epoxy resin E44 and 0.1g is placed in the there-necked flask equipped with condensing reflux and constant pressure dropping funnel, and 8g is housed in the constant pressure funnel Methylvinyldimethoxysilane, slowly add methylvinyldimethoxysilane dropwise in an oil bath at 70°C with mechanical stirring at a speed of 600rpm, and wait until the addition of methylvinyldimethoxysilane is complete Finally, about 1 g of distilled water was added dropwise, and the modified product of the first step was obtained after 4 hours of reaction. On the basis of the modified product in the first step, continue to drop 1g of hydrogen-containing double head in an oil bath at 60°C and stir at 600rpm, and react under the catalysis of 300ppm chloroplatinic acid for 30min to obtain the organosilicon modification epoxy resin.

[0026] The infrared spectrum comparison of the final product of the p...

Embodiment 2

[0030] According to the ratio of the reactants, get 100g double parts of A-type epoxy resin E51 and 0.2g of titanate and place it in a three-necked flask equipped with condensing reflux and a constant pressure dropping funnel, and 9g of formazan is housed in the constant pressure funnel. Vinyl dimethoxysilane, in an oil bath at 80°C, slowly add methyl vinyl dimethoxy silane dropwise in a mechanical stirrer at 500rpm, after the methyl vinyl dimethoxy silane is added dropwise, Then about 1.5 g of distilled water was added dropwise, and the modified product of the first step was obtained after 5 hours of reaction. On the basis of the modified product in the first step, continue to drop 3g of hydrogen-containing silicone oil in an oil bath at 70°C and stir at 600rpm, and react for 60min under the catalysis of 500ppm Karstedt catalyst to obtain a silicone-modified epoxy resin .

Embodiment 3

[0032] According to the proportioning of reactant, get 100g two-part A-type epoxy resin E44 and the titanate of 0.3g and place in the there-necked flask equipped with condensing reflux and constant pressure dropping funnel, 10g of dimethicone is housed in the constant pressure funnel For methyldimethoxysilane, add dimethyldimethoxysilane slowly in an oil bath at 90°C with mechanical stirring at a speed of 300rpm. After the addition of dimethyldimethoxysilane is completed, add dropwise About 1g of distilled water, after 6 hours of reaction, the modified product of the first step can be obtained. On the basis of the modified product in the first step, continue to drop 15g of hydrogen-containing double head in an oil bath at 80°C while stirring at 400rpm, and react for 50min under the catalysis of 400ppm Karstedt catalyst to obtain the silicone modified ring oxygen resin.

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Abstract

The invention discloses a preparation method of organic silicon modified epoxy resin. The method comprises the following steps: mixing epoxy resin and a first catalyst, stirring in an oil-bath pot at70 to 120 DEG C, dropwise adding an organic silicon monomer A, after the organic silicon monomer is completely added, dropwise adding distilled water, reacting for 4 to 8 hours, and obtaining a firstmodified product B, wherein the organic silicon monomer A is one of dimethyldimethoxysiloxane, methyl vinyl dimethoxysiloxane and methyl phenyl dimethoxysiloxane; and under an oil-bath stirring condition at 50 to 90 DEG C, dropwise adding the organic silicon monomer C into the modified product B, adding a second catalyst, reacting for 30 to 90 minutes, and obtaining organic silicon modified epoxyresin. By adopting the preparation method, the organic silicon modified epoxy resin with good heat resistance and toughness is prepared. The preparation method is simple in process, environment-friendly, capable of adopting an ordinary epoxy resin curing process for the modified epoxy resin and suitable for the industrialized production.

Description

technical field [0001] The present invention relates to a preparation method of silicone-modified epoxy resin, in particular to a silicone-modified epoxy resin with good toughness and thermal stability developed for the shortcomings of epoxy resin after curing, which is brittle and poor in heat resistance. Preparation method of permanent epoxy resin. Background technique [0002] Epoxy resin is a very common thermosetting resin. It is an important matrix material in the research and application of polymer composite materials. It is widely used in lamination materials, adhesives, electronic packaging materials and coatings and other industries. It has excellent physical and chemical properties, such as good dimensional stability, small shrinkage of the cured product, excellent corrosion resistance, electrical insulation properties, etc., and is a resin with excellent comprehensive properties. However, epoxy resin will form a large three-dimensional network structure after cu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/14C08G77/42
CPCC08G59/1433C08G77/42
Inventor 何慧邓勇宏刘金明陈芳
Owner SOUTH CHINA UNIV OF TECH
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